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Near-Spherical Single-Crystal Alumina CAS 1344-28-1, Polyhedral α-Al₂O₃ for Thermal Grease TIM & High-Thermal Conductive
Near‑Spherical Single‑Crystal Alumina CAS 1344‑28‑1 is polyhedral near‑spherical alpha‑alumina formed by controlled high‑temperature crystal growth, classification and purification. It retains single‑crystal dense α‑Al₂O₃ lattice without complete melt spheroidization. Polyhedral particle morphology balances thermal conduction performance and slurry fluidity. It is used as thermally‑conductive filler for thermal grease and other TIM thermal interface materials to enhance thermal conductivity of e
High-Thermal Conductivity Spherical Alumina CAS 1344-28-1, α-Al₂O₃ for Thermal Pad Gap Filler & Heat Sink Compound
High‑Thermal Conductivity Spherical Alumina CAS 1344‑28‑1 is dense alpha‑phase spherical alumina manufactured by plasma spheroidization, air classification and impurity purification. Dense α‑Al₂O₃ crystal structure delivers intrinsic high thermal conductivity. Spherical particle shape reduces internal friction within polymer matrix. It is applied as core thermally‑conductive filler for silicone thermal pad, soft gap filler and heat sink compound, establishing effective thermal conduction pathway
High-Sphericity Alumina Powder CAS 1344-28-1, Roundness ≥95% High-Flow for EMC CPO & Low-Viscosity Thermal Resin
High‑Sphericity Alumina Powder CAS 1344‑28‑1 is dense alpha‑phase alumina manufactured by high‑temperature plasma spheroidization, precise airflow classification and shape screening. Particle roundness is controlled at ≥95%. Smooth, regular spherical beads reduce inter‑particle friction. It serves as high‑flow thermally‑conductive filler for epoxy molding compound (EMC), CPO co‑packaged optics encapsulation and low‑viscosity thermal resin, enabling high inorganic loading whilst retaining desirab
Silane-Modified Spherical Alumina Powder CAS 1344-28-1, Hydrophobic Surface-Treated for Resin Compatibility & High-Filling
Silane‑Modified Spherical Alumina Powder CAS 1344‑28‑1 is spherical alpha‑alumina base material subjected to dry silane coupling surface modification treatment. Hydrophobic surface characteristic enhances compatibility with non‑polar and moderate‑polar resin binders. It enables higher filling loading within resin formulations while retaining acceptable slurry fluidity. This surface‑treated thermally‑conductive filler is widely used for thermally‑conductive silicone, epoxy potting compound, EMC a
Large-Particle Spherical Alumina Powder CAS 1344-28-1, >40μm for Potting Compound Casting Resin & High-Loading Filler
Large‑Particle Spherical Alumina Powder CAS 1344‑28‑1 is coarse dense alpha‑phase spherical alumina produced via high‑temperature plasma spheroidization, air classification and granular sieving. Particle size is controlled above 40μm. The smooth spherical bead morphology reduces resin slurry viscosity even at high filling levels. It is used as primary coarse filler for electronic potting compound and thermally‑conductive casting resin, raising packing density, enhancing heat dissipation and opti
Medium Spherical Alumina Powder CAS 1344-28-1, 10–20μm for High-Thermal Plastic Rubber & EMC Filler
Medium Spherical Alumina Powder CAS 1344‑28‑1 is dense alpha‑phase medium‑size spherical alumina produced by high‑temperature plasma spheroidization, air classification and sieving. Particle‑size is strictly controlled within 10‑20μm. Smooth spherical beads lower melt viscosity during polymer compounding. It serves as thermally conductive mineral filler for high‑thermal plastic, thermal‑conductive rubber and semiconductor EMC, enhancing thermal dissipation performance and reducing thermal expans
Micron Spherical Alumina Powder CAS 1344-28-1, 1–5μm for Thermal Interface Material TIM & Conductive Paste
Micron Spherical Alumina Powder CAS 1344‑28‑1 is dense alpha‑phase spherical alumina produced by plasma spheroidization, multi‑stage air classification and impurity removal. The particle‑size range is tightly controlled at 1‑5μm. Smooth spherical particles reduce slurry viscosity during mixing. It is utilized as functional inorganic filler for thermal interface material (TIM) and electronic conductive paste, optimizing thermal conductivity and rheology properties for electronic thermal managemen
Submicron Spherical Alumina Powder CAS 1344-28-1, 0.5–1μm High-Dispersion for High-Loading Resin & Thermal Grease
Submicron Spherical Alumina Powder CAS 1344‑28‑1 is dense alpha‑phase submicron‑size spherical alumina, manufactured by plasma spheroidization, centrifugal classification and dispersion‑optimized post‑treatment. Particle size is controlled within 0.5‑1μm. Optimized particle morphology reduces agglomeration tendency. It is used as thermally conductive filler for high‑loading resin systems and thermal grease, assisting to build uniform thermal conduction pathways while maintaining acceptable slurr
Nano Spherical Alumina Powder CAS 1344-28-1, α-Al₂O₃ <1μm for CMP Polishing Nanocomposite & Precision Ceramic
Nano Spherical Alumina Powder CAS 1344‑28‑1 is alpha‑phase nano‑spherical alumina synthesized via high‑temperature crystallization, plasma spheroidization and precise fractionation. Particle size is controlled below 1μm with narrow particle‑size distribution. Uniform nano‑spherical particles provide moderate hardness and high dispersibility. The powder is applied for CMP chemical‑mechanical polishing slurry, high‑performance polymer nanocomposites and precision ceramic components, improving surf
Low-Sodium Spherical Alumina Powder CAS 1344-28-1, 4N α-Al₂O₃ Na<2ppm for Advanced IC CPO & High-Reliability Encapsulation
Low‑Sodium Spherical Alumina Powder CAS 1344‑28‑1 is 4N ultra‑high‑purity alpha‑phase spherical alumina manufactured by special low‑sodium feedstock, plasma spheroidization and multi‑stage deep purification. Sodium content is strictly controlled under 2ppm. Smooth dense spherical particles help to maintain low resin‑slurry viscosity during compounding. It functions as critical thermally‑conductive inorganic filler for advanced IC chips, CPO co‑packaged optics modules and high‑reliability semicon
High-Purity Spherical Alumina Powder CAS 1344-28-1, α-Al₂O₃ ≥99.9% for Semiconductor EMC CPO & High-Thermal Resin
High‑Purity Spherical Alumina Powder CAS 1344‑28‑1 is produced from high‑purity aluminium‑oxide raw material via high‑temperature plasma spheroidization, multi‑stage air classification and deep purification. α‑Al₂O₃ purity reaches ≥99.9%. Smooth dense spherical particles effectively lower resin system viscosity during compounding. It acts as thermally‑conductive reinforcing filler for semiconductor epoxy molding compound, CPO co‑packaged optics encapsulation and high‑thermal resin composites to
Spherical Alumina Powder General-Purpose CAS 1344-28-1, α-Al₂O₃ 1–10μm for TIM Thermal Conductive & EMC Encapsulation
Spherical Alumina Powder General‑Purpose CAS 1344‑28‑1 is alpha‑phase alumina produced by high‑temperature melting, atomization and air classification. The controlled particle‑size range is 1‑10μm. Spherical morphology reduces slurry viscosity during compounding. It delivers reliable electrical insulation and medium thermal conductivity. This general‑grade filler is widely used for TIM thermal interface materials and EMC semiconductor encapsulation, enhancing heat‑dissipation capability and dime
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