Micron Spherical Alumina Powder CAS 1344‑28‑1 is dense alpha‑phase spherical alumina produced by plasma spheroidization, multi‑stage air classification and impurity removal. The particle‑size range is tightly controlled at 1‑5μm. Smooth spherical particles reduce slurry viscosity during mixing. It is utilized as functional inorganic filler for thermal interface material (TIM) and electronic conductive paste, optimizing thermal conductivity and rheology properties for electronic thermal managemen

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Micron Spherical Alumina Powder CAS 1344‑28‑1, 1–5μm for Thermal Interface Material TIM & Conductive Paste

This micron spherical alumina powder is manufactured from high‑purity alumina raw material through high‑temperature plasma fusion, droplet spheroidization, air‑flow classification and fine sieving treatment. Finished product consists of dense spherical α‑Al₂O₃ particles, with particle‑size distribution strictly controlled within 1‑5μm. Hard agglomerates and oversized rogue particles are eliminated during the classification workflow.

Compared with conventional crushed angular alumina, the smooth spherical morphology decreases inter‑particle friction. When dispersed inside silicone, epoxy or resin‑paste matrix, it helps to moderate viscosity increase at medium‑to‑high filler loading. Dense alpha‑alumina crystal structure provides stable thermal conductivity and reliable electrical insulation. This medium‑fine micron‑size fraction is also suitable for particle gradation design in multi‑modal filler blends.

For Thermal Interface Material (TIM) applications, including thermal grease, thermal pad and gap filler, this micron‑grade spherical alumina builds effective heat‑conduction pathways inside elastomer or oil matrix. It improves overall heat dissipation performance of thermal interface components which are installed between semiconductor chips and metal heat sinks. It can be combined with submicron and larger‑size alumina fractions to achieve optimized particle packing and higher thermal conductivity for high‑performance TIM products.

For electronic conductive paste applications, the alumina acts as an insulating functional filler instead of conductive phase. It adjusts the rheology, thixotropy and shrinkage characteristics of silver‑based or copper‑based conductive paste during curing and sintering processes. It reduces excessive sintering shrinkage, suppresses crack formation within cured paste layer, and improves dimensional stability of printed circuit traces. Strict control over coarse particles is required to avoid scratching fine printed lines during screen‑printing of conductive paste.

Surface silane modification can be performed on this micron spherical alumina powder upon request, which further improves interfacial compatibility between inorganic particles and organic binder phase inside paste or elastomer systems.

During compounding and paste mixing, moderate homogenizing dispersion is recommended. Long‑time intense high‑shear mixing must be avoided. Excessive mechanical force may fracture spherical particles and produce sharp angular fragments, which would raise slurry viscosity and cause abrasion damage to screen‑printing meshes.

Filler loading should be confirmed by formulation trials. Excessive addition will cause overly high viscosity for conductive paste, resulting in poor screen printing performance. Over‑high loading in thermal grease may lead to dry, brittle grease and deteriorate the conformability of thermal interface layers.

The powder should be stored in hermetically sealed, moisture‑proof packaging inside a dry warehouse. Adsorbed ambient moisture may introduce tiny bubbles during paste curing. Physical segregation from submicron, coarse‑micron alumina grades must be maintained in warehouse and feeding procedures to prevent cross‑contamination and irregular particle‑size distribution. This micron‑sized spherical α‑alumina is a versatile functional inorganic filler for thermal interface materials and electronic conductive paste.

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Micron Spherical Alumina Powder CAS 1344-28-1, 1–5μm for Thermal Interface Material TIM & Conductive Paste

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.