Nano Spherical Alumina Powder CAS 1344‑28‑1 is alpha‑phase nano‑spherical alumina synthesized via high‑temperature crystallization, plasma spheroidization and precise fractionation. Particle size is controlled below 1μm with narrow particle‑size distribution. Uniform nano‑spherical particles provide moderate hardness and high dispersibility. The powder is applied for CMP chemical‑mechanical polishing slurry, high‑performance polymer nanocomposites and precision ceramic components, improving surf

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Nano Spherical Alumina Powder CAS 1344‑28‑1, α‑Al₂O₃ <1μm for CMP Polishing Nanocomposite & Precision Ceramic

This nano spherical alumina powder is produced through controlled hydrothermal crystallization followed by high‑temperature plasma spheroidization, multi‑stage centrifugal classification and fine filtration separation. The final product consists of dense spherical α‑Al₂O₃ particles with particle‑size strictly controlled below 1μm. Agglomerated particle clusters are removed during classification processes to guarantee narrow particle‑size distribution.

Compared with conventional irregular ground fine alumina, the spherical particle profile reduces deep scratching risk on workpiece surfaces during polishing operations. The nano‑scale particle dimension brings high specific surface area while retaining the inherent high hardness and chemical stability of alpha‑alumina crystal.

For CMP chemical‑mechanical polishing slurry applications, this nano spherical alumina serves as core abrasive grain. It delivers homogeneous micro‑cutting effect on wafer, hard‑disk substrate and optical component surfaces. Uniform spherical abrasives minimize deep scratch defects, helping to achieve ultra‑smooth surface finish during fine polishing procedures. Strict particle‑size consistency is essential to avoid oversized rogue particles which would cause severe surface damage on precision substrates.

In polymer nanocomposite systems, the nano‑spherical alumina particles can be dispersed inside resin matrix. They reinforce the polymer network, improving surface hardness, wear‑resistance and thermal conductivity of composite materials without inducing sharp viscosity surge when properly dispersed. Surface silane modification can be implemented to further enhance interfacial compatibility between inorganic nano‑particles and organic polymer phase.

For precision ceramic manufacturing, the fine spherical alumina powder acts as sintering raw material. Its spherical particle morphology improves powder packing density inside the green ceramic body, promotes homogeneous sintering shrinkage, lowers sintering temperature and reduces internal micro‑defects within finished precision ceramic parts.

Due to high specific surface area, this nano powder has strong tendency to form secondary agglomerates. During slurry preparation and compounding, sufficient dispersion treatment is required. High‑energy bead milling or ultrasonic dispersion is recommended to break soft secondary agglomerates. Excessively intense milling should be avoided to prevent particle fracture and generation of sharp debris.

Filler loading and sintering parameters require laboratory formulation trials. Over‑high addition in polymer systems may lead to poor flowability and brittleness of finished composites. For ceramic production, improper sintering temperature will result in insufficient densification or abnormal grain growth.

The powder must be stored in hermetically sealed moisture‑proof containers within a dry warehouse environment. Humidity‑induced hard agglomeration will severely degrade polishing performance and sintering behavior. Cross‑contamination with coarse micron‑grade alumina must be strictly prevented in warehouse and feeding operations; even a tiny fraction of coarse particles will generate fatal scratches during CMP polishing. This nano spherical α‑alumina powder is a specialized functional raw material for CMP polishing slurries, high‑performance nanocomposites and high‑end precision ceramic production.

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.