Silane‑Modified Spherical Alumina Powder CAS 1344‑28‑1 is spherical alpha‑alumina base material subjected to dry silane coupling surface modification treatment. Hydrophobic surface characteristic enhances compatibility with non‑polar and moderate‑polar resin binders. It enables higher filling loading within resin formulations while retaining acceptable slurry fluidity. This surface‑treated thermally‑conductive filler is widely used for thermally‑conductive silicone, epoxy potting compound, EMC a

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Silane‑Modified Spherical Alumina Powder CAS 1344‑28‑1, Hydrophobic Surface‑Treated for Resin Compatibility & High‑Filling

This silane‑modified spherical alumina powder uses dense spherical α‑Al₂O₃ as base substrate. The base spherical alumina is produced by high‑temperature plasma spheroidization and air classification. Afterwards, dry‑process silane coupling agent coating is performed under controlled temperature and stirring conditions to form uniform hydrophobic organic thin layer on particle surfaces. No excessive free silane residue remains after post‑treatment.

Untreated spherical alumina features hydrophilic surface. When blended into organic resin matrix, poor interfacial affinity may lead to gaps and micro‑voids at the particle‑resin boundary. These interfacial voids degrade composite mechanical strength, lower thermal conduction efficiency and increase the possibility of moisture penetration inside cured polymer components. The silane modification chemically modifies particle surface to deliver hydrophobic property, improving wet‑out between alumina and epoxy, silicone, thermoplastic and rubber polymer phases.

Better interfacial compatibility allows formulators to achieve higher inorganic filler loading without an abrupt viscosity rise. Higher filling level helps to elevate overall thermal conductivity, raise composite modulus and reduce coefficient of thermal expansion of cured resin composites.

This surface‑treated alumina is applicable for multiple thermal management formulations. It can be incorporated into thermal‑conductive silicone rubber and thermal grease for TIM production. It is suitable for epoxy‑based electronic potting and casting resin for power modules. It also works for epoxy molding compound (EMC) and thermally‑conductive engineering plastic compounds. It reduces interfacial defects and improves long‑term thermal‑cycling resistance of finished electronic components.

The base spherical alumina particle‑size distribution can be customized, including submicron, fine‑micron, medium and coarse particle fractions according to customer formulation requirements. Multi‑modal graded silane‑modified blends can also be prepared for ultra‑high‑loading EMC and potting formulas.

During compounding and kneading processes, high‑shear intensity must be controlled. Excessively fierce mechanical shearing will strip the silane coating layer from alumina particle surfaces. Once the hydrophobic modification layer is destroyed, the filler will revert to hydrophilic behaviour, losing the original compatibility advantage. Moderate homogenizing mixing speed is recommended.

Filler loading should be verified by lab formulation testing. Although surface treatment improves maximum achievable filling, over‑dosage will still increase melt or slurry viscosity, which impairs flowability during injection molding, transfer molding and potting operations.

The finished modified powder shall be packed in hermetically sealed moisture‑proof containers and stored in a dry, cool warehouse. High‑temperature storage should be avoided to prevent degradation of the silane surface coating. Cross‑contamination with unmodified hydrophilic spherical alumina should be strictly prevented during warehouse storage and feeding operations. Mixed modified‑unmodified fractions will cause inconsistent dispersion performance within resin systems. This silane‑hydrophobic‑modified spherical α‑alumina is a high‑performance thermally‑conductive filler designed to enhance resin‑filler interfacial adhesion and realize high‑filling thermal‑management composite formulations.

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.