High‑Sphericity Alumina Powder CAS 1344‑28‑1 is dense alpha‑phase alumina manufactured by high‑temperature plasma spheroidization, precise airflow classification and shape screening. Particle roundness is controlled at ≥95%. Smooth, regular spherical beads reduce inter‑particle friction. It serves as high‑flow thermally‑conductive filler for epoxy molding compound (EMC), CPO co‑packaged optics encapsulation and low‑viscosity thermal resin, enabling high inorganic loading whilst retaining desirab

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High‑Sphericity Alumina Powder CAS 1344‑28‑1, Roundness ≥95% High‑Flow for EMC CPO & Low‑Viscosity Thermal Resin

This high‑sphericity alumina powder adopts high‑purity alumina raw material. The production process includes high‑temperature plasma melting, instantaneous droplet solidification for spheroidization, multi‑stage air classification and special particle‑shape screening procedures. Final product consists of dense α‑Al₂O₃ spherical particles with roundness controlled above 95%. Irregular fragments, ellipsoidal particles and sharp‑edged grit are systematically eliminated during shape‑sorting.

When compared to standard spherical alumina with lower roundness and crushed angular alumina, the near‑perfect spherical geometry greatly lowers inter‑particle friction inside molten or liquid resin systems. At identical filler loading level, the slurry viscosity remains significantly lower. Dense alpha‑alumina crystal provides stable thermal conductivity and reliable electrical insulation. The excellent powder flow property also improves powder feeding performance during compounding production.

For semiconductor EMC epoxy molding compound, the high‑sphericity beads permit higher total filler loading without sacrificing melt flow during transfer molding. Higher filling reduces resin proportion, lowers the overall coefficient of thermal expansion of cured EMC, alleviates internal thermal stress, and decreases risks of package warpage, delamination and popcorn failure during reflow soldering.

For CPO co‑packaged optics encapsulation, the absence of sharp angular particles is critical. It eliminates scratching risks for delicate photonic chips, optical waveguides and ultra‑fine metal wiring inside optoelectronic hybrid packages. The low‑viscosity characteristic of the filled molding compound ensures complete mold filling for tiny, narrow gaps within sophisticated co‑packaged modules.

For low‑viscosity thermal resin including potting and casting resin used in power electronics, this filler facilitates the design of high‑thermal‑conductivity formulations that still maintain good fluidity for dispensing and vacuum potting operations. It can be used as a single‑size fraction or combined with other particle‑size grades to construct multi‑modal ternary particle‑size blends for maximum packing density. Further silane surface modification can be applied upon request to upgrade interfacial adhesion between alumina and resin matrix.

During kneading and compounding processing, excessive high‑shear mixing must be avoided. Violent mechanical collision will fracture the high‑sphericity beads, generate irregular fine debris, destroy the original low‑viscosity advantage and accelerate equipment wear.

Formulation trials are necessary to confirm optimum filler loading. Even with outstanding sphericity, excessive loading will still increase resin viscosity and impair mold filling ability. When developing multi‑modal filler systems, careful matching of different particle‑size fractions is required.

The powder shall be stored inside hermetically sealed moisture‑proof containers within dry warehouse conditions. Humidity‑triggered agglomeration will degrade powder flow performance. Strict physical segregation from lower‑sphericity irregular alumina products is required during storage and feeding; cross‑contamination by angular fragments will directly reduce overall particle roundness of the working filler batch. This high‑sphericity α‑alumina powder is a premium thermally‑conductive inorganic filler for advanced EMC, CPO packaging and low‑viscosity thermal resin composites.

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.