High-Purity Spherical Alumina Powder CAS 1344-28-1, α-Al₂O₃ ≥99.9% for Semiconductor EMC CPO & High-Thermal Resin
High‑Purity Spherical Alumina Powder CAS 1344‑28‑1 is produced from high‑purity aluminium‑oxide raw material via high‑temperature plasma spheroidization, multi‑stage air classification and deep purification. α‑Al₂O₃ purity reaches ≥99.9%. Smooth dense spherical particles effectively lower resin system viscosity during compounding. It acts as thermally‑conductive reinforcing filler for semiconductor epoxy molding compound, CPO co‑packaged optics encapsulation and high‑thermal resin composites to
High‑Purity Spherical Alumina Powder CAS 1344‑28‑1, α‑Al₂O₃ ≥99.9% for Semiconductor EMC CPO & High‑Thermal Resin
This high‑purity spherical alumina powder is manufactured with carefully selected high‑purity alumina feedstock. The production workflow includes high‑temperature plasma melting, droplet spheroidization, centrifugal classification, fine screening and deep impurity removal. Final product consists of dense spherical α‑Al₂O₃ particles with α‑phase crystal structure, and the alumina purity is controlled at ≥99.9%. Strict removal of oversized grit and hard agglomerates is implemented throughout manufacturing.
When compared with conventional ground angular alumina, the spherical particle morphology reduces inter‑particle friction inside resin matrix. It permits relatively high filler loading while maintaining acceptable slurry viscosity during compounding. Dense alpha‑alumina crystal delivers consistent thermal conductivity and excellent volume resistivity for reliable electrical insulation. The deep purification process significantly reduces contents of alkali‑metal ions and heavy‑metal impurities, which helps to restrain electrochemical migration risks inside miniaturized electronic assemblies.
In semiconductor EMC epoxy molding compound applications, this high‑purity spherical alumina is incorporated to raise the overall thermal conductivity of cured molding compound. It builds continuous heat‑conduction pathways within the epoxy matrix, accelerating heat dissipation for power‑intensive chips and reducing local hot‑spot formation. Meanwhile, the rigid inorganic filler increases composite modulus and adjusts the coefficient of thermal expansion of EMC. It mitigates residual thermal stress generated during molding, post‑cure and repeated thermal cycling, decreasing the probability of package delamination, micro‑cracking and warpage.
For CPO co‑packaged optics encapsulation, the absence of coarse sharp particles is critical. It eliminates scratching damage risk to delicate optical waveguides, photonic chips and fine copper circuitry within compact co‑packaged modules. This filler can also be formulated into different high‑thermal resin systems, including thermally conductive potting resin, casting resin and composite matrix resin used for power electronic devices.
It should be noted that although this product achieves 99.9% high purity, sodium content has not been targeted for ultra‑rigorous limitation. For most stringent advanced IC packaging that requires extremely low sodium specification, dedicated 4N low‑sodium spherical alumina shall be selected instead.
During kneading and compounding operations, adequate homogenizing mixing is required to disperse soft particle agglomerates. Unbroken hard agglomerates will leave hard spots and micro‑voids in cured resin, which may become hidden failure points for semiconductor packaging. Severe long‑duration high‑shear kneading must be avoided, as strong mechanical force can fracture spherical particles and generate angular fine fragments. Fragmented particles will push up slurry viscosity and accelerate abrasion of kneaders, screws and molding tools.
Filler loading needs practical formulation testing. Increased filler content improves thermal conductivity, but excessive loading will sharply elevate melt viscosity, deteriorate flow properties of EMC and cause incomplete cavity filling during transfer molding.
The powder shall be stored inside hermetically sealed moisture‑proof packaging in a dry warehouse. Adsorbed surface moisture will interfere with epoxy curing reaction and trigger micro‑bubble defects in molded electronic parts. Complete physical segregation from general‑purpose lower‑purity alumina grades is required in warehouse and feeding systems to prevent cross‑contamination. This high‑purity spherical α‑alumina serves as premium thermally‑conductive inorganic filler for semiconductor EMC, CPO encapsulation and high‑thermal resin composites.
Previous : Spherical Alumina Powder General-Purpose CAS 1344-28-1, α-Al₂O₃ 1–10μm for TIM Thermal Conductive & EMC Encapsulation
Next : Low-Sodium Spherical Alumina Powder CAS 1344-28-1, 4N α-Al₂O₃ Na<2ppm for Advanced IC CPO & High-Reliability Encapsulation
Copy product links
Long by picture save/share
Add Successfully
High-Purity Spherical Alumina Powder CAS 1344-28-1, α-Al₂O₃ ≥99.9% for Semiconductor EMC CPO & High-Thermal Resin
Add Successfully
Jishengya Technology
Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.
点击右上角
分享给朋友吧
Copyright © 2005-2026 Shenzhen Jishengya Technology Co., Ltd. All Rights Reserved.
