Submicron Spherical Alumina Powder CAS 1344‑28‑1 is dense alpha‑phase submicron‑size spherical alumina, manufactured by plasma spheroidization, centrifugal classification and dispersion‑optimized post‑treatment. Particle size is controlled within 0.5‑1μm. Optimized particle morphology reduces agglomeration tendency. It is used as thermally conductive filler for high‑loading resin systems and thermal grease, assisting to build uniform thermal conduction pathways while maintaining acceptable slurr

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Submicron Spherical Alumina Powder CAS 1344‑28‑1, 0.5–1μm High‑Dispersion for High‑Loading Resin & Thermal Grease

This submicron spherical alumina powder is produced from high‑purity alumina feedstock via high‑temperature plasma melting, droplet spheroidization, multi‑stage centrifugal classification and anti‑agglomeration post‑processing. The finished material consists of dense spherical α‑Al₂O₃ particles with targeted particle‑size distribution between 0.5‑1μm. Secondary hard agglomerates are eliminated during classification to achieve high‑dispersion performance.

Compared with irregular ground submicron alumina, the spherical geometry lowers inter‑particle friction. Even at relatively high filling fractions, the rising rate of resin or grease viscosity can be effectively moderated. The alpha‑alumina crystal provides stable thermal conductivity and outstanding electrical insulation. Thanks to the submicron particle dimension, this grade can fill the inter‑particle voids formed by larger‑size spherical alumina beads. It is an ideal fine fraction component for multi‑modal graded filler formulations.

For high‑loading resin applications including epoxy encapsulation resin and silicone composite resin, the well‑dispersed submicron spherical alumina fills interstitial gaps between larger filler particles. It increases total powder packing density of the resin system, enhances overall thermal conductivity and improves the modulus and dimensional stability of cured resin parts. Surface silane modification can be adopted to further strengthen interfacial bonding between inorganic alumina and organic resin matrix, reducing internal micro‑voids at phase boundaries.

For thermal grease formulation, this submicron alumina cooperates with medium and coarse spherical alumina fractions to construct continuous and dense heat‑conducting networks inside the grease base oil. It improves thermal conductivity of finished thermal grease without making the grease overly stiff and dry. Proper particle gradation keeps thermal grease suitable for screen printing, dispensing and manual spreading operations on electronic heat‑dissipation assemblies.

Due to relatively high specific surface area of submicron particles, improper processing will trigger secondary agglomeration. During mixing and compounding, moderate‑speed dispersion is recommended. Severe prolonged high‑energy milling shall be avoided, as it may fracture spherical particles, create sharp fragments and sharply raise system viscosity.

Filler loading and particle gradation require systematic formulation testing. Excessive dosage of the submicron fraction will cause a steep viscosity spike for resin and thermal grease, resulting in poor processability. When preparing multi‑modal blends, matching between this submicron grade and selected coarse alumina fractions must be validated.

The powder shall be packed in hermetically sealed moisture‑proof containers and stored inside a dry warehouse. Ambient moisture will induce hard secondary agglomeration, which damages dispersion performance in grease and resin systems. Strict segregation from nano‑grade and coarse‑micron alumina fractions is required during storage and material feeding to prevent undesired cross‑contamination and inconsistent particle‑size distribution. This high‑dispersion submicron spherical α‑alumina serves as an essential fine thermally‑conductive filler for high‑loading resin composites and electronic thermal grease.

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.