High‑Thermal Conductivity Spherical Alumina CAS 1344‑28‑1 is dense alpha‑phase spherical alumina manufactured by plasma spheroidization, air classification and impurity purification. Dense α‑Al₂O₃ crystal structure delivers intrinsic high thermal conductivity. Spherical particle shape reduces internal friction within polymer matrix. It is applied as core thermally‑conductive filler for silicone thermal pad, soft gap filler and heat sink compound, establishing effective thermal conduction pathway

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High‑Thermal Conductivity Spherical Alumina CAS 1344‑28‑1, α‑Al₂O₃ for Thermal Pad Gap Filler & Heat Sink Compound

This high‑thermal conductivity spherical alumina powder is produced from high‑purity alumina feedstock via high‑temperature plasma melting, droplet spheroidization, multi‑stage air classification and fine sieving. The finished product consists of fully dense spherical α‑Al₂O₃ particles. Internal closed pores are minimized during plasma treatment to preserve the intrinsic high thermal‑conductivity property of alpha‑alumina crystal. Porous defective beads and hard agglomerates are removed throughout classification processes.

In comparison with irregular crushed alumina, the smooth spherical particle geometry lowers inter‑particle friction in silicone or hydrocarbon base media. It permits relatively high filler loading without causing an excessive sharp increase of system viscosity. The dense alpha crystal lattice provides stable thermal conductivity as well as excellent electrical insulation, preventing short‑circuit risk inside electronic assemblies. This alumina can be compounded with different particle‑size fractions to build multi‑modal graded filler systems for maximizing packing density and thermal performance.

For thermal pad production, the spherical alumina is blended into silicone rubber matrix during kneading. Interconnected filler particles form continuous heat‑conducting networks inside the elastomer. It raises the bulk thermal conductivity of finished thermal pads used between CPU, power semiconductor chips and metal heat sinks. Proper particle‑size gradation also helps to maintain suitable elasticity and compression compliance of the silicone thermal pad under mechanical pressure.

For soft gap filler materials, this filler enables high thermal conductivity while retaining the soft, deformable property. The gap filler can fill uneven gaps between densely‑arranged power electronic components and cooling structures, eliminating air pockets which would hinder heat transfer.

For heat sink compound (thermal grease), spherical alumina works together with matched fine and submicron fractions inside mineral or silicone base oil. It builds dense thermal conduction pathways. The spherical morphology helps to keep thermal grease smooth and spreadable, avoiding excessive thickening and gritty texture during dispensing and manual application.

Silane surface modification is available upon customer request. Surface treatment improves wetting between alumina particles and silicone or oil‑based binder, reducing interfacial thermal resistance at particle‑matrix boundaries and further lifting overall thermal performance of final thermal interface products.

During material mixing and kneading operations, severe high‑shear processing should be avoided. Strong mechanical impact fractures spherical beads, producing sharp fine fragments. Fragmented particles will increase slurry viscosity, introduce gritty texture to grease and accelerate abrasion of mixing equipment.

Formulation development requires practical laboratory testing. Higher filler loading improves thermal conductivity, but excessive dosage will reduce elasticity of thermal pad and gap‑filler elastomer, and make thermal grease stiff and difficult to spread. Multi‑modal particle gradation is strongly recommended to strike a balance between thermal conductivity and processability.

The powder shall be stored in hermetically‑sealed moisture‑proof packaging in a dry warehouse. Humidity‑induced agglomeration damages dispersion in silicone and oil systems, resulting in local hot‑spots inside finished thermal interface materials. Strict segregation from porous low‑density alumina grades is necessary during storage and feeding to avoid cross‑contamination that would degrade bulk thermal‑conductivity. This high‑thermal‑conductivity spherical α‑alumina serves as core inorganic filler for thermal pad, soft gap filler and heat sink compound for electronic thermal management.

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.