Spherical Alumina Powder General‑Purpose CAS 1344‑28‑1 is alpha‑phase alumina produced by high‑temperature melting, atomization and air classification. The controlled particle‑size range is 1‑10μm. Spherical morphology reduces slurry viscosity during compounding. It delivers reliable electrical insulation and medium thermal conductivity. This general‑grade filler is widely used for TIM thermal interface materials and EMC semiconductor encapsulation, enhancing heat‑dissipation capability and dime

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Spherical Alumina Powder General‑Purpose CAS 1344‑28‑1, α‑Al₂O₃ 1–10μm for TIM Thermal Conductive & EMC Encapsulation

This general‑purpose spherical alumina powder is manufactured from industrial‑grade alumina feedstock through high‑temperature fusion, atomization spheroidization and multi‑stage air classification. The final product is composed of dense α‑Al₂O₃ spherical particles with particle‑size distribution tightly controlled between 1‑10μm. Angular fragments and oversized agglomerates are removed during classification workflow.

Compared with ground angular alumina powder, the spherical particle geometry decreases inter‑particle friction. When blended into resin or silicone matrix, it helps restrain sharp viscosity rise at relatively high filler loading. Dense alpha crystal structure provides moderate thermal conductivity and outstanding electrical insulation performance. It serves as a cost‑effective thermally conductive mineral filler without ultra‑high‑purity premium specifications.

For TIM thermal interface material applications including thermal grease, thermal pad and gap filler, this spherical alumina builds continuous heat‑conducting pathways inside the elastomer matrix. It improves heat transfer efficiency between heat‑generating semiconductor chips and cooling heat sinks, lowering operating temperature of electronic assemblies.

For EMC epoxy molding compound encapsulation, the alumina filler increases the modulus and hardness of cured molding compound. It reduces overall coefficient of thermal expansion of the plastic package and enhances heat dissipation capacity of encapsulated discrete semiconductors and standard IC devices. This general‑purpose grade is not controlled for ultra‑low‑sodium content; accordingly it is not recommended for advanced high‑reliability CPO or HBM packaging which requires strict sodium‑ion limitation.

Trace residual alkali impurities exist within acceptable ranges for conventional electronic applications. During compounding and kneading, sufficient homogenizing mixing is required to break soft particle agglomerates. Hard agglomerates left in the mixture may create voids, pinholes and surface defects within cured TIM or molded EMC packages. Excessively fierce high‑shear processing shall be avoided to prevent particle fragmentation. Broken particles will increase slurry viscosity and accelerate abrasion of production equipment.

Filler loading should be optimized through formulation testing. Higher loading improves thermal conductivity but will significantly increase system viscosity, which impairs flowability of EMC melt during transfer molding and reduces flexibility of soft thermal pads.

The powder shall be stored in sealed moisture‑proof packaging inside dry warehouse. Moisture absorption will negatively influence curing behavior of epoxy and silicone systems, potentially generating micro‑bubbles inside finished components. Strict segregation from high‑purity low‑sodium alumina grades is necessary during transportation, storage and feeding operations to prevent cross‑contamination. This general‑purpose spherical alpha alumina powder is a versatile cost‑efficient thermally conductive mineral filler for standard TIM thermal interface materials and conventional EMC semiconductor encapsulation.

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Spherical Alumina Powder General-Purpose CAS 1344-28-1, α-Al₂O₃ 1–10μm for TIM Thermal Conductive & EMC Encapsulation

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.