Low‑Sodium Spherical Alumina Powder CAS 1344‑28‑1 is 4N ultra‑high‑purity alpha‑phase spherical alumina manufactured by special low‑sodium feedstock, plasma spheroidization and multi‑stage deep purification. Sodium content is strictly controlled under 2ppm. Smooth dense spherical particles help to maintain low resin‑slurry viscosity during compounding. It functions as critical thermally‑conductive inorganic filler for advanced IC chips, CPO co‑packaged optics modules and high‑reliability semicon

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Low‑Sodium Spherical Alumina Powder CAS 1344‑28‑1, 4N α‑Al₂O₃ Na<2ppm for Advanced IC CPO & High‑Reliability Encapsulation

This low‑sodium spherical alumina powder is produced from specially selected low‑sodium precursor raw material. The manufacturing procedure includes high‑temperature plasma melting, droplet spheroidization, air‑flow classification, fine sieving and targeted deep alkali‑ion removal purification. The finished product consists of dense spherical α‑Al₂O₃ particles with 4N purity grade. Sodium impurity is rigorously restricted to less than 2ppm, and other alkali‑metal contaminants are also tightly monitored. Oversized grit and hard agglomerates are eliminated throughout the production workflow.

Compared with conventional 99.9% high‑purity spherical alumina, the core advantage of this grade lies in ultra‑low sodium concentration. Sodium ions are highly mobile under high‑temperature and high‑humidity operating conditions within microelectronic devices. Once sodium ions migrate, they may cause metal corrosion of fine circuit traces, gate leakage and gradual degradation of semiconductor components, which is fatal for advanced high‑reliability chips. The strict sodium‑control specification is designed to mitigate such ionic‑migration‑related failure modes.

The well‑rounded spherical morphology reduces inter‑particle friction. When incorporated into epoxy molding compound resin matrix, this filler allows relatively high loading while avoiding drastic viscosity increase of molten compound. Dense alpha‑alumina crystal provides stable thermal conductivity and excellent electrical insulation, building continuous heat‑transfer pathways inside cured packaging material to dissipate heat generated by high‑performance chips.

For advanced IC encapsulation, this low‑sodium alumina is formulated into high‑reliability EMC. It adjusts the coefficient of thermal expansion of molding compound, reduces residual thermal stress during molding and thermal cycling, and lowers the incidence of package warpage, internal delamination and micro‑cracks.

For CPO co‑packaged optics applications, the ultra‑low‑ionic characteristic prevents electrochemical corrosion of ultra‑fine metal wiring inside optoelectronic hybrid packages. Removal of sharp coarse particles avoids mechanical scratching on photonic chips, waveguides and delicate circuit structures. This product is exclusively engineered for high‑end semiconductor packaging; it is not an economical choice for general‑purpose thermal interface materials or ordinary casting resin.

During compounding and EMC kneading, moderate homogenizing mixing is required to disperse soft agglomerates. Hard agglomerates that remain in the mixture will form hard spots and micro‑voids in the cured molding compound, creating hidden reliability risks for sophisticated semiconductor packages. Violent long‑term high‑shear kneading must be avoided. Excessive mechanical impact fractures spherical beads and generates angular fine fragments, which will raise melt viscosity and accelerate the abrasion of kneading equipment and transfer molds.

Formulation trials are necessary to optimize filler loading. Higher filler loading improves thermal conductivity, yet excessive addition increases melt viscosity and impairs mold filling performance during transfer molding.

The powder should be stored in hermetically sealed, moisture‑proof packaging inside a dry warehouse. Adsorbed moisture will interfere with epoxy curing reaction and produce micro‑bubbles inside molded semiconductor packages. Strict physical segregation must be enforced during storage and feeding to avoid cross‑contamination by ordinary alumina grades with higher sodium content. Even minor contamination from standard alumina will break the Na＜2ppm specification. This 4N low‑sodium spherical α‑alumina powder serves as a high‑performance thermally‑conductive filler for advanced IC, CPO and other high‑reliability semiconductor encapsulation systems.

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.