Medium Spherical Alumina Powder CAS 1344‑28‑1 is dense alpha‑phase medium‑size spherical alumina produced by high‑temperature plasma spheroidization, air classification and sieving. Particle‑size is strictly controlled within 10‑20μm. Smooth spherical beads lower melt viscosity during polymer compounding. It serves as thermally conductive mineral filler for high‑thermal plastic, thermal‑conductive rubber and semiconductor EMC, enhancing thermal dissipation performance and reducing thermal expans

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Medium Spherical Alumina Powder CAS 1344‑28‑1, 10–20μm for High‑Thermal Plastic Rubber & EMC Filler

This medium spherical alumina powder is manufactured from high‑purity alumina feedstock via high‑temperature plasma melting, droplet spheroidization, multi‑stage air classification and precise sieving. The finished product consists of dense spherical α‑Al₂O₃ particles, with particle‑size distribution tightly controlled from 10μm to 20μm. Oversized grit and fine hard agglomerates are removed during the classification and screening procedures.

In comparison with irregular crushed alumina powder, the rounded bead‑shaped morphology reduces inter‑particle friction when blended into molten polymer matrix. It permits higher filler loading without causing an extreme rise in melt viscosity during extrusion, injection molding and internal mixing processes. Dense alpha‑alumina crystal delivers stable thermal conductivity and outstanding electrical insulation. This medium particle fraction is widely used as the primary coarse component for multi‑modal graded filler formulations.

For high‑thermal thermoplastic applications, this medium spherical alumina is compounded into engineering plastics during extrusion. It establishes continuous heat‑conduction pathways inside thermoplastic resin, elevating overall thermal conductivity of molded plastic parts for power module housings and heat‑dissipating structural components. The rigid alumina particles also decrease thermal expansion of thermoplastic composites and restrain component deformation under periodic temperature cycling.

For thermally‑conductive rubber, the powder is incorporated during rubber kneading. It improves heat dissipation of silicone rubber gaskets, sealing elements and thermal‑conductive rubber sheets. Proper particle‑size gradation together with fine alumina fractions helps to balance thermal conductivity and rubber elasticity.

For semiconductor EMC epoxy molding compound, this medium‑size spherical alumina acts as the main skeleton filler in multi‑modal particle blends. It increases total packing density of inorganic fillers, improves heat dissipation of plastic encapsulated chips, and adjusts the coefficient of thermal expansion of the cured molding compound to reduce package internal stress. This grade is not recommended for ultra‑fine‑feature CPO packaging, where smaller particle sizes are required to avoid scratching delicate photonic structures.

Surface silane treatment can be applied upon request to enhance interfacial adhesion between alumina particles and polymer or epoxy matrix, minimizing micro‑voids at the phase boundary.

During compounding and kneading operations, excessive high‑shear processing should be avoided. Severe mechanical impact will fracture spherical alumina beads, generating irregular fine fragments, increasing system viscosity and accelerating abrasion of extruder screws, kneader rotors and injection molds.

Filler loading needs formulation validation. Over‑dosage will reduce polymer toughness and elasticity, making rubber and plastic parts brittle. When used for multi‑modal EMC filler blending, matching with submicron and fine‑micron alumina fractions should be tested.

The powder shall be stored in hermetically sealed moisture‑proof containers inside a dry warehouse. Moisture absorption may lead to voids and bubble defects during polymer extrusion or EMC molding. Strict physical segregation from fine‑micron and large‑particle alumina products is required during storage and feeding to prevent unwanted cross‑contamination of particle‑size fractions. This medium‑sized spherical α‑alumina powder is a key thermally‑conductive filler for high‑thermal engineering plastic, thermal‑conductive rubber and semiconductor EMC encapsulation.

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.