Submicron Spherical Fused Silica Powder CAS 7631‑86‑9 is amorphous fused silica produced by high‑temperature flame spheroidization, wet classification and dispersion‑optimized purification. Particle‑size range is strictly controlled at 0.5‑1μm. Uniform spherical geometry and minimized hard agglomeration provide superior dispersibility within liquid resin. It is applied in high‑loading thermoset resin and optical adhesive formulations to lower curing shrinkage, adjust thermal expansion and mainta

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Submicron Spherical Fused Silica Powder CAS 7631‑86‑9, 0.5–1μm High‑Dispersion for High‑Loading Resin & Optical Adhesive

This submicron spherical fused silica powder is manufactured starting from high‑purity quartz raw material. The production workflow includes high‑temperature flame melting and spheroidization, followed by multi‑stage wet centrifugal classification, fine filtration and surface modification adjustment to reduce inter‑particle attraction. The final product yields amorphous spherical silica particles within 0.5‑1μm narrow particle‑size distribution. Oversized coarse grains are thoroughly removed during classification to eliminate scratch risks for precision optical components.

Compared with nano‑sized fused silica, this 0.5‑1μm submicron grade shows less pronounced van‑der‑Waals attraction between individual particles, which greatly reduces the tendency to form hard agglomerates. It enables higher filler loading inside resin matrices while maintaining acceptable slurry viscosity. The smooth spherical particle morphology lowers internal friction of resin‑filler slurry, which is essential for high‑loading resin formulation development.

In high‑loading resin applications such as electronic potting and casting epoxy, the filler reduces overall curing exotherm, suppresses resin shrinkage, and decreases the coefficient of thermal expansion of cured composites. It improves modulus and compressive strength of finished resin parts, and alleviates internal residual stress that arises after cross‑linking curing.

For optical adhesive, the narrow particle‑size distribution and high‑dispersion characteristics are critical. When the silica refractive index is properly matched with adhesive resin matrix, well‑dispersed submicron spherical particles will not introduce obvious light‑scattering and haze. The filler restricts thermal expansion of cured optical adhesive bonding layers, mitigating warpage and delamination of optical modules during temperature cycling. It is suitable for optical bonding assemblies used in display, imaging and optoelectronic devices.

Metallic‑ion impurities are strictly controlled throughout production. Elevated ionic contamination would degrade insulation properties of electronic potting resin and may induce local light absorption within optical adhesive. Hard agglomerates constitute the major quality risk: residual agglomerates will create micro‑scattering spots inside optical adhesive and form defects in cured high‑loading resin. High‑shear mixing is recommended during compounding to achieve uniform particle dispersion. Filler loading must be carefully optimized; excessive addition will increase slurry viscosity and trigger light‑scattering haze in optical adhesive.

The submicron powder is prone to moisture pickup. It shall be stored in hermetically sealed moisture‑proof packaging inside dry warehouse environments. During storage and material transfer, strict segregation from nano‑grade or coarse micron‑grade silica must be enforced to avoid cross‑contamination by off‑size particles. This high‑dispersion submicron spherical fused silica powder acts as a premium functional mineral filler for high‑loa

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.