Micron Spherical Fused Silica Powder CAS 7631‑86‑9 is amorphous fused silica produced from high‑purity quartz via high‑temperature flame fusion, spheroidization and precision air‑jet classification. The particle‑size range is tightly controlled within 1‑5μm. Smooth spherical particles offer good powder flow and favorable resin dispersion performance. It serves as a key mineral filler for epoxy molding compound, CPO co‑packaged optics encapsulation and a broad range of general‑electronic resin fo

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Micron Spherical Fused Silica Powder CAS 7631‑86‑9, 1–5μm for EMC Encapsulation CPO & General Electronic Filler

This micron‑grade spherical fused silica powder is manufactured from selected quartz feedstock through high‑temperature flame melting, spheroidization treatment, multi‑stage air classification and fine sieving. The resultant material consists of amorphous non‑crystalline SiO₂ spherical particles with narrow particle‑size distribution controlled from 1μm to 5μm. Oversized coarse grit and excessive fine nano‑fraction are removed during classification to stabilize particle‑size distribution.

Compared with finer sub‑micron grades, this 1‑5μm product exhibits lower specific surface area, which reduces resin demand for particle wetting. It allows relatively high filler loading without sharp viscosity surge of epoxy molding compound slurry. In contrast to larger‑size spherical fused silica, the smaller micron particle dimension is well‑suited for molding modules with narrow runner gaps and tiny cavity features. Its amorphous microstructure provides a low coefficient of thermal expansion, enabling better expansion‑matching between silicon die, lead frame and cured epoxy matrix. Thermal‑cycling‑derived internal stress is relieved, lowering risks of package cracking, delamination and warpage.

For EMC encapsulation applications, this silica filler can be deployed in medium‑to‑high filling formulations for discrete semiconductors, standard ICs. For CPO co‑packaged optics encapsulation, the controlled particle size avoids abrasive scratching on delicate optical waveguide structures and optoelectronic components inside the module. Consistent particle‑size distribution helps maintain stable flow characteristics during transfer‑molding, reducing molding‑related defects such as incomplete filling, voids and flash.

For general‑electronic filling including insulating potting resin, electronic structural epoxy composites, this filler enhances mechanical modulus and compressive strength, moderates curing exothermic peak, and reduces resin shrinkage upon hardening. Trace metallic ion impurities are tightly controlled to minimize risks of electrochemical migration and leakage current within electronic assemblies.

During compounding and EMC kneading processes, sufficient homogenizing mixing is required to break soft particle agglomerates. Remaining agglomerates may generate micro‑voids or hard spots, which will damage fine metal circuits or optical elements in molded components. Formulation engineers should optimize filler loading; excessively high loading will increase melt viscosity and impair mold filling capacity during transfer molding.

The powder must be stored in sealed moisture‑proof containers within dry warehouse conditions. Moisture absorption prior to compounding will interfere with epoxy curing reaction and cause bubble formation inside cured resin. Strict physical segregation from sub‑micron and larger‑particle silica grades is required in warehouse and feeding systems to prevent cross‑contamination of particle fractions. This 1‑5μm micron spherical fused silica powder is a versatile electronic‑grade mineral filler for EMC encapsulation, CPO modules and general‑electronic resin systems.

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.