Nano Spherical Fused Silica Powder CAS 7631‑86‑9 is amorphous fused silica manufactured via high‑temperature spheroidization, wet‑mode classification and fine purification. The particle size is controlled below 1μm at sub‑micron‑nano range. Uniform spherical morphology brings outstanding dispersibility, low thermal expansion and stable dielectric performance. It serves as key mineral filler for flip‑chip underfill resin and high‑frequency copper‑clad laminate (CCL), minimizing resin shrinkage an

Product Detail

Nano Spherical Fused Silica Powder CAS 7631‑86‑9, Sub‑Micron <1μm for Underfill Flip‑Chip & High‑Frequency CCL

This nano spherical fused silica powder is produced from high‑purity quartz feedstock through high‑temperature flame fusion, spheroidization, wet classification, centrifugal fractionation and multi‑stage purification procedures. The final product consists of amorphous spherical silica particles with controlled particle size less than 1μm. Strict particle‑size distribution control eliminates oversized coarse particles which may cause scratching damage on micro‑circuit traces or micro‑bumps of semiconductor chips.

Different from micron‑sized spherical fused silica, this sub‑micron nano grade possesses much finer particle dimension. Fine spherical particles can penetrate into narrow gap spaces between flip‑chip silicon die and substrate. It is suitable for fine‑gap underfill formulations. The smooth spherical morphology reduces internal friction inside resin systems, helping to suppress sharp viscosity elevation even at relatively high filler loading. The amorphous silica structure features low coefficient of thermal expansion, which reduces curing shrinkage of underfill resin and relieves thermal‑cycling‑induced mechanical stress on micro solder bumps. It effectively improves long‑term connection reliability of flip‑chip interconnections.

For high‑frequency CCL copper‑clad laminate applications, this nano spherical fused silica filler is incorporated into resin matrix of high‑speed circuit substrates. It helps to lower thermal expansion of the laminate sheet, restricts substrate warpage during high‑temperature lamination. Meanwhile, the silica filler maintains stable low‑dielectric characteristics at high‑frequency working conditions, reducing signal attenuation and preserving high‑frequency signal integrity for high‑speed communication circuit boards.

Trace metallic ion impurities are tightly controlled during production to avoid insulation degradation and electrochemical migration risks within microelectronic substrates. Special attention must be paid to particle agglomeration for this nano‑submicron grade. Hard agglomerates cannot be broken simply by conventional stirring. If hard agglomerates remain inside resin slurry, they may result in micro‑cracks, surface protrusions and circuit short‑circuit hazards for finished CCL or underfill assemblies.

During compounding processing, appropriate dispersing agents and high‑shear dispersion equipment are recommended to achieve homogeneous distribution of nano silica within resin systems. Excessive filler loading will significantly raise resin viscosity and deteriorate flow behavior. Formulation trials are required to optimize filler content for each specific resin system.

The nano silica powder is susceptible to moisture absorption. It should be stored in hermetically sealed, moisture‑proof packaging inside dry warehouse. Strict segregation from coarse‑micron silica products is required during material transportation, storage and feeding operations to prevent coarse particle cross‑contamination. This nano spherical fused silica powder is a premium fine mineral filler dedicated to flip‑chip underfill encapsul

Previous : Low-Alpha Spherical Fused Silica Powder CAS 7631-86-9, Ultra-Low Radioactivity for Advanced IC CPO Encapsulation & HBM Next : Submicron Spherical Fused Silica Powder CAS 7631-86-9, 0.5–1μm High-Dispersion for High-Loading Resin & Optical Adhesive

Copy product links

Long by picture save/share

Add Successfully

Continue To Visit Inquiry Now

Nano Spherical Fused Silica Powder CAS 7631-86-9, Sub-Micron <1μm for Underfill Flip-Chip & High-Frequency CCL

enquiry

Add Successfully

Continue To Visit Inquiry Now

Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.