Sol‑gel spherical silica filler ranging 0.1‑1.5μm, CAS 7631‑86‑9. It is synthesized via sol‑gel wet‑chemistry route to obtain amorphous spherical silica featuring narrow particle‑size distribution. With deep purification to achieve low‑alpha performance, this inorganic filler is designed for CPO underfill encapsulant and high‑reliability electronic materials. It improves slurry rheology, lowers composite thermal expansion coefficient and suppresses alpha‑particle‑caused soft‑errors for microelec

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Product Detail PageSpherical Silica Filler Sol‑Gel 0.1‑1.5μm CAS 7631‑86‑9, Narrow PSD for CPO Underfill Low‑Alpha Electronic MaterialThis sol‑gel spherical silica filler is manufactured through controlled sol‑gel wet chemical reaction, aging, calcination and precise classification, delivering amorphous spherical silica particles within 0.1‑1.5μm with narrow particle‑size distribution (PSD). Unlike flame‑fused silica, the sol‑gel process minimizes sintered agglomerates and irregular deformed beads. Deep raw‑material purification reduces trace uranium and thorium radioactive contaminants to realize reliable low‑alpha properties.

For CPO underfill applications, the well‑defined particle‑size range enables the filler to flow smoothly into ultra‑narrow gaps between silicon chip and substrate during dispensing. Narrow PSD avoids abnormal viscosity spikes of underfill slurry, supporting consistent filling performance in fine‑pitch advanced packaging. After curing, the silica filler decreases the coefficient of thermal expansion of underfill resin, alleviating cyclic thermal shear stress on micro solder bumps. This effectively lowers failure risks such as solder joint fatigue and interfacial delamination inside CPO packages.

The low‑alpha characteristic restricts alpha‑particle emission, which is essential to prevent soft‑error malfunctions for high‑density memory and logic chips. Rigorous purification also controls alkali‑metal and heavy‑metal impurities, eliminating ion‑migration‑related insulation degradation under high‑temperature and humid working conditions for finished electronic assemblies.

This sol‑gel silica exhibits good baseline compatibility with epoxy‑based underfill resin systems. Custom silane surface modification can be performed to strengthen interfacial adhesion between spherical silica particles and polymer matrix, further enhancing the mechanical strength and moisture resistance of cured underfill composites. It can be blended with other fine silica grades for graded particle‑size formulations when specific rheological targets are required for different CPO underfill recipes.

Due to fine particle dimensions, the powder is susceptible to moisture‑triggered agglomeration. Hermetic low‑humidity storage is required. During weighing, conveying and compounding operations, strict segregation from ordinary high‑alpha silica products must be enforced to avoid cross‑contamination that would compromise the low‑alpha specification. This sol‑gel spherical silica filler serves as a high‑performance inorganic filling material for CPO underfill and other high‑reliability low‑alpha electronic materials.

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Spherical Silica Filler Sol-Gel 0.1–1.5μm CAS 7631-86-9, Narrow PSD for CPO Underfill Low-Alpha Electronic Material

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.