High‑purity fumed silica nanopowder, primary particle size 5‑50nm, CAS 112945‑52‑5. It is produced by high‑temperature flame hydrolysis of silicon‑based precursors. The nano‑sized silica network delivers prominent thixotropic and anti‑sedimentation effects. This functional inorganic nanopowder is applied for CMP sealant, liquid resin and CPO thixotropic systems to control slurry rheology, improve suspension stability and reinforce cured polymer matrix for semiconductor manufacturing materials.

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Product Detail PageFumed Silica Nanopowder 5‑50nm CAS 112945‑52‑5, High‑Purity for CMP Sealant Liquid Resin & CPO ThixotropicThis high‑purity fumed silica nanopowder is synthesized via high‑temperature flame‑hydrolysis process of silicon‑containing precursors. The primary particle size ranges from 5 nm to 50 nm. Nano‑scale primary particles form loose three‑dimensional aggregate structures, which are responsible for its characteristic rheological modification capability. Strict purification workflow minimizes heavy‑metal and ionic contaminants to satisfy the stringent purity requirements of semiconductor‑grade material systems.

When incorporated into CMP sealant formulations, the fumed silica network builds reversible thixotropic structure within the sealant slurry. At static state, it increases apparent viscosity and prevents settling of solid functional fillers inside the sealant. Under shear force during dispensing and coating operations, slurry viscosity declines to guarantee smooth and uniform coating performance on CMP equipment sealing components. It also enhances scratch resistance and dimensional stability after the sealant resin is fully cured.

For general liquid resin systems, this fumed silica acts as an efficient rheology modifier. It inhibits sedimentation of other inorganic fillers during storage, avoids sagging on vertical coating surfaces, and delivers moderate reinforcing effect to improve hardness and anti‑abrasion properties of cured resin parts.

Within CPO thixotropic liquid resin for advanced semiconductor packaging, the nano‑silica controls flow behavior of liquid encapsulant. It prevents resin run‑off during dispensing on fine‑pitch chip assemblies, ensuring precise encapsulant shaping around CPO packaging structures. Low impurity levels reduce the risk of ion migration under high‑humidity and high‑temperature operating conditions, protecting the reliability of microelectronic circuits.

Both hydrophilic and hydrophobic surface grades are available. Hydrophilic fumed silica is suitable for polar resin matrices, while hydrophobic modified grades demonstrate better dispersion in non‑polar resin systems. Adequate high‑shear dispersion is mandatory during compounding to break hard agglomerates and fully develop the thixotropic network.

The nanopowder has extremely large specific surface area, which makes it highly sensitive to moisture adsorption. Sealed storage under low‑humidity environment is required. Fine dust prevention measures should be adopted during powder feeding and mixing to avoid material loss and cross‑contamination. This high‑purity fumed silica nanopowder is an essential rheological functional filler for CMP sealant, liquid resin and thixotropic CPO semiconductor packaging resin formulations.

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.