Low‑Alpha Spherical Fused Silica Powder CAS 7631‑86‑9 is manufactured from carefully selected low‑radioactivity quartz ore through high‑temperature fusion, flame atomization, multi‑stage classification and dedicated radioactive‑element removal purification. Alpha‑particle emission rate is controlled at an extremely low level. With spherical amorphous particle morphology, low thermal expansion and high electrical insulation, this filler is developed for high‑end advanced semiconductor packaging i

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Low‑Alpha Spherical Fused Silica Powder CAS 7631‑86‑9, Ultra‑Low Radioactivity for Advanced IC CPO Encapsulation & HBM

This low‑alpha spherical fused silica powder adopts strictly screened low‑radioactivity quartz raw materials to limit initial concentrations of uranium and thorium radioactive trace elements. The production workflow includes high‑temperature melting, flame spheroidization, air classification, special chemical purification and fine sieving. Rigorous finished‑product testing is implemented to guarantee ultra‑low alpha‑particle emission. The final particles are amorphous fused silica with smooth spherical geometry.

Alpha particles released from U‑Th decay chains in conventional mineral fillers can strike tiny memory cells inside high‑density semiconductors and induce transient soft errors, which severely threatens operational stability for HBM, high‑speed logic chips and CPO co‑packaged optics modules. By suppressing alpha‑particle emission, this specialty silica filler effectively mitigates such soft‑error failure modes for advanced microelectronic devices.

The spherical particle morphology reduces inter‑particle friction. When compounded into epoxy molding compound, it maintains moderate slurry viscosity and delivers excellent mold flow property for sophisticated, fine‑feature transfer‑molding processes. Its low coefficient of thermal expansion enables good thermal‑expansion matching among silicon die, interposer, copper substrate and cured EMC resin. It alleviates thermal‑induced internal stress during molding, post‑cure and repeated thermal cycling, lowering risks of package delamination, micro‑cracking and warpage for thin and complex advanced IC packages.

For CPO co‑packaged optics encapsulation, consistent filler quality is essential to avoid defects that would interfere with optical signal transmission inside the integrated packaging module. For HBM high‑bandwidth‑memory packaging, ultra‑low‑alpha performance directly improves memory reliability under high‑speed continuous operating conditions. This grade can also be adopted for other high‑density advanced logic chip EMC formulations that have strict soft‑error control requirements.

Metallic‑ion impurity levels are also tightly controlled alongside alpha‑particle specifications, restraining leakage current and electrochemical migration risk within miniaturized semiconductor packages. During EMC compounding, sufficient homogenizing mixing is required to break soft particle agglomerates. Residual agglomerates may generate micro‑voids, pinholes or abrasive scratches on delicate silicon and optical components during molding.

Strict moisture‑proof storage is mandatory. The product is packed in sealed moisture‑proof drums and should be preserved inside a dry, low‑humidity warehouse. Material handling must achieve complete segregation from standard‑alpha‑emission silica grades. Even minor cross‑contamination with ordinary fused silica will raise overall alpha‑particle counts and destroy the low‑alpha performance. This low‑alpha spherical fused silica powder is a critical high‑grade mineral filler for advanced IC, CPO and HBM semiconductor encapsulation.

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.