Nano Alpha Alumina Powder (α-Al2O3) CAS 1344-28-1, Silane-Modified Thermally Conductive Filler and Polishing Abrasive
Nano Alpha Alumina Powder (α‑Al₂O₃) is crystalline alpha‑phase aluminium oxide manufactured via high‑temperature calcination, ultrafine pulverization, classification and subsequent silane surface modification. The α‑phase crystal structure endows the powder with outstanding hardness, high thermal conductivity and stable chemical inertness. After silane treatment, nano‑sized alumina particles achieve better dispersion and interfacial bonding within organic resin matrices. This dual‑function mater
Product DetailsThis nano alpha alumina powder is produced through high‑temperature calcination of aluminium hydroxide raw material to form stable alpha‑phase crystal grains. Subsequent ultrafine grinding and precise air‑classification tightly control the nano‑range particle‑size distribution and reduce oversized grit contamination which causes surface scratches during polishing processes. A controlled silane‑modification procedure is applied onto the particle surface to alter the inherent hydrophilic property of alumina powder.
Without surface treatment, bare nano‑alumina particles tend to form hard agglomerates inside resin systems. The silane coating improves wettability with epoxy, silicone, and various engineering polymers. It suppresses particle agglomeration during compounding, facilitates uniform dispersion, and enhances interfacial thermal transfer across the filler‑resin boundary.
The product exhibits high Mohs hardness, excellent thermal conductivity, superior electrical insulation, strong acid‑alkali resistance and low impurity content. When deployed as a thermally conductive filler in electronic potting adhesives, thermal interface materials and thermally conductive plastics, it effectively raises overall thermal conductivity of the composite while retaining good insulating performance and mechanical strength of finished components.
As a precision polishing abrasive, the nano‑sized hard alpha‑alumina grains deliver fine, consistent polishing removal rates. It is suitable for surface polishing of optical lenses, semiconductor wafers, ceramic components and precision metal parts, helping to achieve ultra‑smooth finished surfaces with minimal micro‑scratch defects.
Typical application areas include thermally conductive silicone potting compounds, epoxy thermal management adhesives, thermal‑conductive engineering plastics, semiconductor component polishing slurry, precision metal and ceramic polishing formulations.
Packaging specification is 25 kg inner‑liner moisture‑proof woven bags. Keep packaging well‑sealed during transportation and storage. Store inside cool, dry warehouse to avoid moisture absorption and secondary agglomeration of nano‑particles. Prevent excessive stacking height on pallets. Wear dust‑proof masks and protective gloves during powder handling.
Previous : Aluminum Hydroxide ATH (Aluminium Trihydrate) CAS 21645-51-2, Silane-Coated HFFR Flame Retardant Filler for Cable Compounds
Next : Silane-Coated Calcined Alumina (Aluminum Oxide Al2O3) CAS 1344-28-1, Thermally Conductive Filler for Potting Compounds
Copy product links
Long by picture save/share
Add Successfully
Nano Alpha Alumina Powder (α-Al2O3) CAS 1344-28-1, Silane-Modified Thermally Conductive Filler and Polishing Abrasive
Add Successfully
Jishengya Technology
Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.
点击右上角
分享给朋友吧
Copyright © 2005-2026 Shenzhen Jishengya Technology Co., Ltd. All Rights Reserved.
