Silane‑Coated Calcined Alumina (Aluminum Oxide Al₂O₃) is produced from high‑purity aluminium hydroxide through high‑temperature calcination, ultrafine grinding, air classification and silane surface coating. The rigid calcined alumina crystal delivers outstanding thermal conductivity and superior electrical insulation performance. Silane surface treatment improves the compatibility between alumina particles and organic polymer matrices. This functional mineral filler is primarily developed for e

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Product DetailsThis silane‑coated calcined alumina starts with high‑purity aluminium hydroxide feedstock. High‑temperature calcination forms stable alpha‑alumina crystalline particles. Subsequent ultrafine grinding and precise air‑classification strictly control particle‑size distribution and eliminate coarse grit contaminants. After classification, continuous silane surface‑coating treatment is implemented on powder particles.

Untreated calcined alumina shows strong hydrophilic surface property. When directly incorporated into silicone or epoxy potting resins, it is prone to agglomeration, poor flowability and increased compound viscosity, which adversely affects potting processing. The silane coating modifies the particle surface from hydrophilic to organophilic. It strengthens interfacial adhesion between alumina filler and resin molecules, reduces system viscosity at high filling loading, and improves powder dispersion inside the potting matrix.

The material features high thermal conductivity, excellent volume resistivity, outstanding chemical inertness and low heavy‑metal impurity levels. When filled into electronic potting compounds, it builds continuous heat‑conducting pathways inside cured resin. Excess heat generated during the operation of power electronic components can be efficiently conducted outward, lowering the internal operating temperature of modules. Meanwhile, the rigid alumina particles enhance the hardness, compressive strength and anti‑abrasion performance of cured potting layers, providing reliable physical protection for embedded circuit boards and chips.

It is compatible with two‑component epoxy potting resin, addition‑cure silicone potting rubber and other thermosetting potting systems. Typical application fields include power supply module encapsulation, inverter potting, sensor sealing, and other electronic potting formulations requiring both thermal dissipation and electrical insulation.

Packaging is 25 kg moisture‑proof woven bags with inner polyethylene liner. During transportation and warehouse storage, the packages should remain tightly sealed to prevent moisture absorption which would degrade resin compatibility. Avoid excessive stacking height on pallets to prevent bag rupture and powder caking. Dust‑proof masks and protective gloves are required for powder handling operations.

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Silane-Coated Calcined Alumina (Aluminum Oxide Al2O3) CAS 1344-28-1, Thermally Conductive Filler for Potting Compounds

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.