High‑Sphericity Fused Silica Powder CAS 7631‑86‑9 is amorphous fused silica produced under optimized high‑temperature flame spheroidization process, followed by shape screening and air classification. Particle roundness is controlled ≥95%. The well‑rounded particle geometry lowers friction between particles, providing outstanding powder flow and helping maintain low viscosity at high filler loading. It is applied for EMC semiconductor encapsulation, CPO co‑packaged optics modules and low‑viscosi

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High‑Sphericity Fused Silica Powder CAS 7631‑86‑9, Roundness ≥95% High‑Flow for EMC CPO & Low‑Viscosity Resin

This high‑sphericity fused silica powder is manufactured from high‑purity quartz feedstock. Advanced high‑intensity flame spheroidization technology is adopted to fully melt silica droplets for sufficient surface tension‑driven shaping. Subsequent multi‑stage air classification and shape‑based separation remove irregular, ellipsoidal and angular defective particles. Final finished material features amorphous SiO₂ particles with particle roundness controlled at minimum 95%.

Compared with conventional standard‑grade spherical fused silica which contains a certain fraction of slightly deformed or irregular particles, this high‑sphericity grade greatly reduces sharp protrusions and irregular contours on particle surfaces. Inter‑particle sliding friction is significantly decreased. When dispersed into liquid epoxy resin matrix, the well‑rounded particles roll freely within the resin medium. Under identical filler loading, the resultant resin slurry exhibits distinctly lower viscosity. This property enables formulators to increase total filler content without causing excessive viscosity rise, which is essential for developing low‑viscosity high‑loading resin formulations.

For EMC epoxy molding compound, improved melt flow behavior facilitates transfer‑molding into tiny, intricate mold cavities of compact semiconductor packages. It reduces molding defects including incomplete filling, voids and resin flash. For CPO co‑packaged optics encapsulation, the smooth, highly spherical particles minimize scratching risk on delicate optical waveguides, optical chips and fine metal circuitry inside the module. Low thermal expansion of amorphous silica still delivers effective stress relief during thermal cycling, lowering package warpage and delamination probability.

In general low‑viscosity resin systems including electronic potting, precision casting epoxy and composite matrix resin, this filler improves powder handling performance during dry blending. It also enhances mechanical modulus and dimensional stability of cured resin parts. Trace metallic impurities are strictly controlled to satisfy electronic‑grade requirements and suppress electrochemical migration risks within microelectronic assemblies.

During compounding and kneading operations, excessive violent high‑shear processing should be avoided. Strong mechanical impact may produce particle fragmentation, generating small angular fragments that will degrade the original high‑flow property of this filler. Filler loading should be optimized through formulation testing; although higher loading is achievable, over‑loading will eventually increase viscosity and impair flow performance.

The product must be stored in sealed moisture‑proof packaging within dry warehouse conditions. Moisture absorption will negatively affect epoxy curing and induce bubble defects in molded parts. Strict segregation from lower‑roundness conventional fused silica grades is necessary during storage, transportation and feeding. Cross‑contamination with irregular silica particles will reduce average roundness of mixed powder and weaken slurry fluidity advantage. This high‑sphericity fused silica powder serves as a premium shape‑controlled mineral filler for EMC, CPO encapsulation and low‑viscosity electronic resin formulations.

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High-Sphericity Fused Silica Powder CAS 7631-86-9, Roundness ≥95% High-Flow for EMC CPO & Low-Viscosity Resin

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.