Silane‑Modified Spherical Fused Silica Powder CAS 7631‑86‑9 is produced by flame spheroidized spherical fused silica with dedicated silane coupling agent surface modification treatment. The hydrophilic hydroxyl groups on particle surface are chemically converted into hydrophobic organic layers. It significantly enhances interfacial compatibility between inorganic silica and thermoset resin. The modified powder is suitable for high‑loading formulations of epoxy molding compound, potting resin and

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Silane‑Modified Spherical Fused Silica Powder CAS 7631‑86‑9, Hydrophobic Surface‑Treated for Resin Compatibility & High‑Filling

This silane‑modified spherical fused silica powder is based on flame‑spheroidized amorphous fused silica base powder. After classification and purification, the silica particles undergo dry‑phase or wet‑phase silane coupling agent surface coating process. Chemical reaction occurs between silane functional groups and surface silanol hydroxyl groups of silica. A uniform hydrophobic organic molecular layer is formed on the particle exterior, replacing native hydrophilic surface characteristics of untreated fused silica.

Without silane modification, bare silica surfaces carry abundant silanol groups. These hydrophilic sites tend to adsorb ambient moisture. In resin compounding, bare silica particles also show weak interfacial affinity toward non‑polar or moderately polar epoxy matrices, which may trigger micro‑voids at the inorganic‑organic boundary. Poor interfacial adhesion reduces composite mechanical strength and facilitates water penetration along particle‑resin interfaces under humid conditions.

After silane modification, the hydrophobic surface improves wet‑out performance when the powder is mixed into liquid resin. Inter‑particle agglomeration tendency is reduced. Formulators can achieve higher filler loading while maintaining acceptable system viscosity. Strong chemical linkage between silica surface and resin matrix improves interfacial bonding inside cured composites. It enhances flexural strength and fracture toughness of cured resin parts, and restricts moisture diffusion along phase boundaries, which is highly valuable for electronic encapsulation materials.

For EMC epoxy molding compound, this hydrophobic modified silica helps to lower the moisture absorption rate of finished semiconductor packages, reducing the risk of popcorn effect during reflow soldering. In epoxy potting and casting resin systems, it improves mechanical properties of thick‑section cast components. The product can be supplied on different base particle‑size fractions ranging from sub‑micron, medium micron to coarse large particles according to customer formulation requirements.

During compounding and kneading, homogenized mixing is required to avoid local aggregation of modified silica. Even though surface treatment has been completed, excessive high‑shear kneading should be avoided. Severe mechanical friction may strip the silane coating layer from particle surfaces and revert partial particles back to hydrophilic state, which would degrade the expected modification performance.

Moisture‑proof storage remains necessary even for this hydrophobic grade. The product shall be sealed and stored in dry warehouse conditions. High‑temperature long‑term storage is forbidden, as thermal aging can cause decomposition of the surface silane coating. Strict segregation from unmodified fused silica grades is required in warehouse and feeding processes. Cross‑contamination with untreated silica will reduce overall hydrophobic property and interfacial performance of final resin formulations. This silane‑modified spherical fused silica powder is a critical surface‑treated inorganic filler to realize high‑filling, low‑moisture‑sensitivity resin composite systems for electronics and industrial composites.

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.