Low‑Dielectric Spherical Fused Silica Powder CAS 7631‑86‑9 is produced from high‑purity low‑impurity quartz through high‑temperature flame spheroidization, multi‑stage purification and precise classification. It features inherent low‑Dk and low‑Df properties across high‑frequency ranges. Smooth spherical particle morphology delivers favorable resin fluidity. The filler is used for 5G high‑speed copper‑clad laminate and antenna substrate materials, reducing thermal expansion of substrate sheets a

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Low‑Dielectric Spherical Fused Silica Powder CAS 7631‑86‑9, Low‑Dk Low‑Df for 5G High‑Frequency High‑Speed CCL & Antenna

This low‑dielectric spherical fused silica powder is manufactured using carefully selected high‑purity quartz raw material with restricted alkali‑metal and transition‑metal impurities. The production workflow consists of high‑temperature flame fusion, droplet spheroidization, air classification, fine sieving and deep purification. The finished product is composed of amorphous SiO₂ spherical particles. Strict control over ionic impurities is critical because residual conductive ions would raise dielectric loss under high‑frequency working conditions and degrade communication signal integrity.

Unlike conventional mineral fillers with higher dielectric values, amorphous fused silica possesses intrinsic low‑Dk and low‑Df characteristics. Its dielectric parameters remain relatively stable when frequency shifts into 5G high‑speed millimeter‑wave bands. The smooth spherical particle geometry reduces inter‑particle friction inside resin slurry, allowing reasonably high filler loading without excessive viscosity growth during substrate resin compounding. Low coefficient of thermal expansion helps constrain overall thermal expansion of the laminate sheet. It alleviates substrate warpage that occurs during high‑temperature lamination, drilling and subsequent reflow soldering processing for circuit boards.

In high‑frequency high‑speed CCL copper‑clad laminate applications, this silica filler is incorporated into thermoset resin matrix. It suppresses signal attenuation and phase distortion of high‑speed transmission lines on the printed circuit substrate. Stable dielectric performance guarantees consistent electrical properties across different operating temperatures, which is essential for high‑speed server and 5G communication circuit hardware.

For 5G antenna substrate formulations, the filler improves dimensional stability of antenna dielectric plates. It reduces thermal deformation under continuous radio‑frequency power load, helping antenna modules maintain stable resonant frequency during long‑term service. This grade is not intended for standard semiconductor EMC encapsulation unless the formulation specifically targets low‑dielectric requirements.

During substrate compounding, homogeneous dispersion is essential. Particle agglomerates will create localized resin‑rich or filler‑rich zones on the laminate sheet, resulting in inconsistent regional dielectric values across the substrate panel, which causes uneven electrical performance of finished circuit boards. High‑shear dispersion conditions are recommended, while severe particle fracture must be avoided; broken angular particles may damage copper foil surfaces during hot lamination.

The powder requires moisture‑proof sealed storage inside dry warehouse. Water adsorption on particle surfaces will increase localized dissipation factor and introduce unstable dielectric performance in cured laminates. Material segregation is mandatory during storage and feeding to avoid cross‑contamination with ordinary high‑ionic fused silica grades. Impurity‑contaminated powder will lose its low‑dielectric advantages. This low‑dielectric spherical fused silica powder serves as a key inorganic filler for 5G high‑frequency high‑speed CCL and communication antenna dielectric substrate manufacturing.

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.