Fused Silica Powder High-Purity Amorphous CAS 7631-86-9, SiO₂ ≥99.9% for EMC Casting Compound & CPO Filler
High‑purity amorphous fused silica powder features SiO₂ content ≥99.9%. Produced through high‑temperature melting and quenching process to eliminate crystalline silica phase. It serves as critical inorganic filler for EMC epoxy molding compound, casting compound and CPO semiconductor packaging materials, delivering low thermal expansion coefficient, outstanding electrical insulation and good compatibility with epoxy resin systems.
Product Detail PageFused Silica Powder High‑Purity Amorphous CAS 7631‑86‑9, SiO₂ ≥99.9% for EMC Casting Compound & CPO FillerThis high‑purity amorphous fused silica powder is manufactured by melting natural silica feedstock at ultra‑high temperature followed by rapid water quenching, which transforms crystalline quartz into stable amorphous silica structure. The product maintains SiO₂ content ≥99.9% with strictly controlled metallic and ionic impurities.
Without sharp crystal edges, the amorphous particle morphology reduces abrasion to mixing equipment during compounding production. When incorporated into epoxy resin matrices for EMC and casting compound, the filler effectively decreases overall thermal expansion coefficient of the cured composite, alleviating thermal‑induced stress on semiconductor chips within CPO packaging modules.
Low ionic impurity level suppresses leakage current under long‑term high‑temperature and humid operating conditions, ensuring reliable insulating performance for electronic components. The graded particle‑size distribution supports high filler loading while keeping acceptable slurry viscosity for casting‑type molding processes.
It demonstrates favorable compatibility with epoxy, novolac phenolic hardeners and common curing accelerators used within semiconductor encapsulation formulations. Particle‑size fractions can be selected to match different casting compound viscosity targets and flow requirements.
Material should be sealed and stored under dry conditions to prevent moisture uptake prior to compound preparation. Cross‑contamination with other mineral fillers must be avoided during powder conveying and batching. This amorphous fused silica powder is a preferred inorganic filler solution for high‑grade EMC, casting compound and CPO advanced semiconductor encapsulation applications.
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Fused Silica Powder High-Purity Amorphous CAS 7631-86-9, SiO₂ ≥99.9% for EMC Casting Compound & CPO Filler
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