Spherical Silica Filler High-Purity Fused CAS 7631-86-9, 98.7% Sphericity for CPO EMC Encapsulation & High-Flow Resin
High‑purity fused spherical silica filler with 98.7% sphericity. It is manufactured by high‑temperature fusion process to form smooth, nearly perfect spherical amorphous silica particles. This filler effectively reduces system viscosity while enabling high loading, specifically developed for CPO, EMC semiconductor encapsulation compounds and high‑flow thermoset resin formulations in advanced microelectronic packaging.
Product Detail PageSpherical Silica Filler High‑Purity Fused CAS 7631‑86‑9, 98.7% Sphericity for CPO EMC Encapsulation & High‑Flow ResinThis high‑purity fused spherical silica filler is produced via rigorous high‑temperature melting and atomizing treatment, yielding amorphous silica particles with a sphericity of 98.7%. The smooth spherical particle morphology sharply decreases internal friction between resin and filler particles, permitting higher filler loading without excessive viscosity rise within the resin matrix.
Controlled impurity levels reduce ionic contaminants, supporting reliable insulating performance for semiconductor packaging materials. It is a key inorganic filler material targeted for CPO and EMC epoxy molding compound, as well as various high‑flow resin systems for microelectronic encapsulation.
Uniform particle shape helps improve melt flow behavior during molding operations, lowering internal stress inside the cured encapsulation layer. It restrains thermal expansion coefficient of cured resin composite, mitigating thermal‑mechanical mismatch between molding compound and semiconductor chips under alternating temperature cycling.
Strict particle‑size distribution control minimizes oversized coarse particles which could cause scratch damage to delicate die surfaces during molding. The product shows good compatibility with epoxy, phenolic and other thermoset resin matrices.
Recommended loading range shall be adjusted according to targeted resin formula and processing viscosity requirement. Dry storage under low‑humidity environment is required to prevent moisture absorption before compounding. Avoid contamination with foreign mineral impurities during material handling and feeding for EMC compound production. This fused spherical silica filler is suitable for advanced packaging manufacturing where high sphericity, good flowability and consistent electrical insulation are mandatory for CPO and EMC encapsulation.
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Spherical Silica Filler High-Purity Fused CAS 7631-86-9, 98.7% Sphericity for CPO EMC Encapsulation & High-Flow Resin
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