Spherical Alumina Filler Low‑Sodium α‑Al₂O₃ CAS 1344‑28‑1, D50 1.9μm for TIM CPO Thermal Conductive Resin
Low‑sodium spherical α‑Al₂O₃ filler, CAS 1344‑28‑1, D50 1.9 μm. Produced by high‑temperature spheronization and strict purification to minimize sodium impurities. This inorganic thermal conductive filler is specially designed for TIM thermal interface material and CPO thermal‑conductive resin formulations. It improves thermal dissipation capacity of polymer matrix while maintaining favorable rheological property for advanced semiconductor thermal management.
Product Detail PageSpherical Alumina Filler Low‑Sodium α‑Al₂O₃ CAS 1344‑28‑1, D50 1.9μm for TIM CPO Thermal Conductive ResinThis low‑sodium spherical α‑alumina filler is manufactured through high‑temperature spheronization, calcination and multi‑step purification process. The final product features regular spherical particle morphology with D50 controlled at 1.9 μm. Rigorous purification treatment restricts sodium content to a very low level, effectively reducing mobile alkali‑ion contaminants which threaten long‑term electrical reliability of microelectronic assemblies.
The spherical particle contour decreases inter‑particle friction inside resin matrices. Compared with irregular angular alumina powders, this spherical grade enables relatively high filler loading without sharp viscosity rise of thermal‑conductive resin slurry. Higher filling level helps to elevate bulk thermal conductivity of cured composite, supporting efficient heat dissipation for high‑power semiconductor devices used in CPO advanced packaging and TIM thermal‑interface applications.
When incorporated into TIM thermal interface resin, the fine 1.9 μm particle size is suitable for thin‑gap thermal bonding structures. Uniform particle dimension helps form compact filler packing within thin resin layers, building continuous heat‑conduction pathways between chip and heat sink. Low sodium specification suppresses electrochemical migration risk under combined high‑temperature and humid operating conditions, which is essential for long‑term service reliability of high‑density CPO packaging modules.
The filler shows good compatibility with epoxy, silicone and other polymer matrices commonly adopted for thermal conductive compounds. Silane surface modification can be applied on request to enhance interfacial adhesion between alumina particle surface and resin, further lowering composite internal thermal resistance and improving moisture resistance. It can be blended with larger‑size spherical alumina grades to construct graded particle‑size distribution, achieving maximized filling fraction for high‑performance thermal management formulations.
Strict particle classification removes oversized coarse grains to prevent scratch damage on delicate semiconductor surfaces during dispensing and curing procedures. The powder material shall be sealed and stored under dry conditions to avoid moisture absorption. Cross‑contamination with ordinary high‑sodium alumina products must be prevented during weighing, feeding and compounding operations. This low‑sodium 1.9 μm spherical α‑alumina filler serves as a premium thermal‑conductive inorganic filler for TIM thermal‑interface materials and CPO thermal‑conductive resin systems in advanced semiconductor thermal management.
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Spherical Alumina Filler Low‑Sodium α‑Al₂O₃ CAS 1344‑28‑1, D50 1.9μm for TIM CPO Thermal Conductive Resin
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