Spherical Fused Silica Filler Flame-Fused CAS 7631-86-9, D50 5–40μm for EMC CPO Low-Expansion Encapsulation
Flame‑fused spherical fused silica filler produced via high‑temperature flame fusion process, with D50 particle‑size range of 5‑40μm. Smooth spherical amorphous silica particles help reduce resin‑matrix viscosity, permit high loading, and lower composite thermal expansion. It is an essential inorganic filler for EMC and CPO low‑expansion semiconductor encapsulation materials.
Product Detail PageSpherical Fused Silica Filler Flame‑Fused CAS 7631‑86‑9, D50 5‑40μm for EMC CPO Low‑Expansion EncapsulationThis spherical fused silica filler is manufactured by flame‑fusion treatment of silica feedstock. Raw silica particles are instantly melted inside high‑temperature flame zone, then rapidly cooled to form well‑rounded amorphous spherical silica particles with D50 from 5μm to 40μm. The flame‑fused production route yields consistent spherical morphology and effectively reduces sharp angular particle fragments.
Smooth spherical particle surfaces decrease inter‑particle friction within epoxy resin systems. It allows higher filler loading of EMC formulations while maintaining acceptable melt flow during transfer molding. The low thermal expansion property of silica filler suppresses overall thermal expansion coefficient of cured epoxy molding compound, which is critical for CPO and conventional semiconductor encapsulation. It relieves thermal‑mechanical stress between molding compound and silicon chips during repeated temperature cycling, decreasing the risks of package delamination and internal crack.
Graded particle‑size distribution within the 5‑40μm range can be adjusted to satisfy different formula requirements for EMC grades. Metallic and ionic impurities are tightly controlled to maintain excellent electrical insulation performance, avoiding leakage or reliability degradation of packaged semiconductor devices under high‑humidity and high‑temperature operating conditions.
The filler shows good compatibility with epoxy resins, phenolic hardeners and common curing accelerators applied in semiconductor encapsulation formulations. Oversized grit is strictly removed during classification, preventing die scratching during molding operations.
The powder material should be kept in sealed, low‑humidity storage conditions to prevent moisture absorption before compounding. Strict isolation from other mineral powders is required during material handling to eliminate cross‑contamination. This flame‑fused spherical fused silica filler provides reliable low‑expansion filling solution for high‑performance EMC and CPO semiconductor encapsulation.
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Spherical Fused Silica Filler Flame-Fused CAS 7631-86-9, D50 5–40μm for EMC CPO Low-Expansion Encapsulation
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