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Phenyl MQ Silicone Resin CAS 67763-19-3, High-Refractive-Index Heat-Resistant MQ Resin for LED Encapsulation & High-Temp Coating

Phenyl MQ Silicone Resin CAS 67763‑19‑3 is a phenyl‑modified MQ silicone resin obtained from co‑hydrolysis and polycondensation of phenyl‑containing silane, methyl silane and tetrafunctional silicate monomers. The introduction of phenyl groups raises refractive index and enhances high‑temperature resistance of the three‑dimensional resin skeleton. It is applied as modifying resin for LED optical encapsulation silicone and high‑temperature protective coating, boosting optical property, thermal st

Phenyl MQ Silicone Resin CAS 67763‑19‑3, High‑Refractive‑Index Heat‑Resistant MQ Resin for LED Encapsulation & High‑Temp Coating

This phenyl‑modified MQ silicone resin is manufactured by controlled co‑hydrolysis and polycondensation of phenylalkoxysilane, methyl silane and tetrafunctional silicate raw materials. Its molecular backbone consists of monofunctional M‑units and tetrafunctional Q‑units, with phenyl groups covalently grafted onto the siloxane framework. The phenyl loading can be precisely adjusted during synthesis to regulate refractive index, thermal stability and resin solubility, catering to different requirements for LED optical encapsulation and high‑temperature coating.

Compared with conventional all‑methyl MQ silicone resin, the aromatic phenyl moieties significantly increase the material’s refractive index. Meanwhile, rigid phenyl structures strengthen thermal‑oxidative resistance and suppress thermal decomposition under continuous high‑temperature conditions. The resin maintains good compatibility with methyl‑phenyl linear silicone polymers, which is critical for preparing homogeneous optical silicone systems without light‑scattering haze.

When utilized in LED encapsulation silicone formulations, this phenyl MQ resin acts as an effective modifying component. It elevates the overall refractive index of the cured encapsulant, improving light‑extraction efficiency of LED chips. It enhances hardness and modulus of the cured encapsulation layer, reduces yellowing tendency under long‑term high‑power LED operation, and alleviates thermal‑induced softening of the silicone matrix.

For high‑temperature silicone coating applications, the resin improves coating‑film hardness, scratch resistance and long‑term thermal ageing performance. The finished coating exhibits excellent heat‑resistant performance when protecting metal substrates under sustained elevated‑temperature service conditions. It restrains thermal oxidation and delays coating cracking at high operating temperatures.

This phenyl MQ silicone resin dissolves readily in aromatic hydrocarbon solvents and high‑boiling silicone fluids. For optical‑grade LED encapsulation formulas, strict control over ionic impurities and trace metal contaminants is essential. Residual metallic ions would accelerate photo‑thermal ageing and cause premature yellowing of LED encapsulant.

During compounding processing, prolonged low‑speed stirring is recommended to guarantee complete dissolution and homogeneous blending with base silicone polymers. Insufficient dissolution will produce tiny resin aggregates, which form light‑scattering speckles and severely degrade LED optical performance. Formulation dosage should be optimized in accordance with targeted refractive‑index and hardness specifications.

The product shall be stored in hermetically sealed packaging within a cool, dry and dark environment. Avoid direct sunlight exposure and excessive thermal history. Cross‑contamination with sulfur‑containing or nitrogen‑containing impurities must be strictly avoided, as these contaminants will induce catalyst poisoning for hydrosilylation LED encapsulation systems. This high‑refractive‑index phenyl MQ silicone resin is a specialized modifying raw material for LED optical encapsulation silicone and high‑temperature resistant silicone protective coatings.


Phenyl MQ Silicone Resin CAS 67763-19-3, High-Refractive-Index Heat-Resistant MQ Resin for LED Encapsulation & High-Temp Coating
Phenyl MQ Silicone Resin CAS 67763‑19‑3 is a phenyl‑modified MQ silicone resin obtained from co‑hydrolysis and polycondensation of phenyl‑containing silane, methyl silane and tetrafunctional silicate monomers. The introduction of phenyl groups raises refractive index and enhances high‑temperature resistance of the three‑dimensional resin skeleton. It is applied as modifying resin for LED optical encapsulation silicone and high‑temperature protective coating, boosting optical property, thermal st
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Phenyl MQ Silicone Resin CAS 67763-19-3, High-Refractive-Index Heat-Resistant MQ Resin for LED Encapsulation & High-Temp Coating

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