VMC‑processed nano spherical silica filler, particle‑size 0.2‑0.4μm, CAS 7631‑86‑9. Adopting specialized VMC manufacturing workflow, this low‑alpha amorphous spherical silica restricts alpha‑particle emission. It is designed for CPO EMC semiconductor encapsulation and optical adhesive, lowering soft‑error incidence for memory‑related chips while maintaining high light transmittance in optical bonding resin systems.

Product Detail

Product Detail PageNano Spherical Silica Filler VMC Process 0.2‑0.4μm CAS 7631‑86‑9, Low‑Alpha for CPO EMC & Optical AdhesiveThis nano spherical silica filler is produced via proprietary VMC synthesis and spheronization technology, delivering tightly controlled particle‑size distribution within 0.2‑0.4μm. Strict raw‑material screening and deep purification steps reduce uranium and thorium trace radioactive impurities to realize low‑alpha performance, which is essential for advanced semiconductor devices sensitive to alpha‑particle‑triggered soft errors.

The smooth amorphous spherical morphology reduces internal friction within resin matrices. When used in CPO EMC epoxy molding compound, this filler enables controlled viscosity during molding. It decreases the thermal expansion coefficient of cured encapsulation material, alleviating thermal‑mechanical stress between molding compound and silicon die under thermal cycling. The low‑alpha characteristic significantly cuts the probability of memory soft‑faults for high‑density CPO packaged chips.

For optical adhesive applications, fine spherical particles avoid severe light‑scattering effects. The filler can be incorporated into transparent optical bonding formulations to adjust modulus, shrinkage and thermal expansion of cured adhesive layer without substantial loss of visible‑light transmittance. It helps restrain thermal‑induced dimensional shift of optical bonding layers in display and optoelectronic assemblies.

Heavy‑metal and ionic contaminants are tightly controlled to preserve reliable electrical insulation. Optional silane surface modification improves interfacial affinity between silica particles and epoxy, acrylate or other resin binders, suppressing particle agglomeration in adhesive slurry.

Due to the fine particle dimension, the powder is prone to agglomeration upon moisture absorption. Sealed storage under low‑humidity conditions is required. During batching and material transfer, cross‑contamination with ordinary high‑alpha silica grades must be strictly prevented to preserve the critical low‑alpha specification. This VMC‑processed nano spherical silica filler serves as a premium inorganic filling material for high‑reliability CPO EMC encapsulation and high‑performance optical adhesive systems.

Previous : Nano Spherical Silica Filler 0.3μm/100nm CAS 7631-86-9, for CPO Underfill High-Frequency CCL & Nanocomposite Next : Submicron Spherical Silica Filler 0.9–1.2μm CAS 7631-86-9, for EMC CPO High-Filling Low-Viscosity Resin

Copy product links

Long by picture save/share

Add Successfully

Continue To Visit Inquiry Now

Nano Spherical Silica Filler VMC Process 0.2–0.4μm CAS 7631-86-9, Low-Alpha for CPO EMC & Optical Adhesive

enquiry

Add Successfully

Continue To Visit Inquiry Now

Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.