Nano Spherical Silica Filler 0.3μm/100nm CAS 7631-86-9, for CPO Underfill High-Frequency CCL & Nanocomposite
Nano spherical silica filler with particle sizes of 100 nm and 0.3 μm, CAS 7631‑86‑9. Uniform amorphous spherical nanoparticles deliver excellent dispersion in resin matrices. The filler is specially developed for CPO underfill encapsulant, high‑frequency copper‑clad laminate (CCL) and electronic resin nanocomposites, to adjust dielectric characteristics, reduce thermal expansion and reinforce composite mechanical performance.
Product Detail PageNano Spherical Silica Filler 0.3μm/100nm CAS 7631‑86‑9, for CPO Underfill High‑Frequency CCL & NanocompositeThis nano spherical silica filler is supplied in two targeted particle‑size grades: 100 nm and 0.3 μm. It adopts high‑temperature synthesis and precise classification to produce amorphous, near‑perfect spherical silica nanoparticles. Rigorous particle‑size screening eliminates residual coarse particles that would damage ultra‑fine circuit structures in high‑end electronic substrates.
For CPO underfill applications, the nano‑scale spherical particles can penetrate extremely narrow gaps between chip bumps and the substrate. Good dispersion suppresses slurry viscosity spikes at moderate‑to‑high loading. After curing, the filler reduces the coefficient of thermal expansion of underfill resin, mitigating cyclic thermal shear stress on micro solder bumps, which effectively enhances the long‑term reliability of fine‑pitch CPO packaging.
When incorporated into high‑frequency CCL formulations, well‑dispersed spherical silica modulates the dielectric constant and dissipation factor of the laminate composite. It supports stable high‑speed signal transmission for high‑frequency circuit boards, while improving dimensional stability and reducing thermal warpage during multi‑layer lamination.
Within resin‑based electronic nanocomposites, these spherical silica nanoparticles act as reinforcing fillers to enhance modulus, surface hardness and scratch resistance of the cured polymer matrix without introducing severe brittleness. The product maintains strictly controlled ionic and heavy‑metal impurity levels to avoid electrical leakage risks for high‑performance electronic components.
Surface silane treatment is optional to further improve interfacial adhesion between silica nanoparticles and epoxy, polyimide or other resin systems. The nano silica powder is highly susceptible to moisture‑induced agglomeration, so sealed low‑humidity storage is mandatory. Cross‑contamination with coarse mineral fillers must be prevented during weighing, feeding and compounding operations. This dual‑grade nano spherical silica filler is a key inorganic filler for advanced CPO underfill, high‑frequency CCL and high‑performance electronic nanocomposite materials.
Previous : Submicron Spherical Silica Filler 0.7μm CAS 7631-86-9, High-Dispersion for CPO Underfill & High-Loading Resin
Next : Nano Spherical Silica Filler VMC Process 0.2–0.4μm CAS 7631-86-9, Low-Alpha for CPO EMC & Optical Adhesive
Copy product links
Long by picture save/share
Add Successfully
Nano Spherical Silica Filler 0.3μm/100nm CAS 7631-86-9, for CPO Underfill High-Frequency CCL & Nanocomposite
Add Successfully
Jishengya Technology
Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.
点击右上角
分享给朋友吧
Copyright © 2005-2026 Shenzhen Jishengya Technology Co., Ltd. All Rights Reserved.
