Multi‑Modal Spherical Alumina Powder Blend CAS 1344‑28‑1 is a ready‑to‑use ternary graded spherical α‑Al₂O₃ blend. It is produced by precise metered mixing of coarse, medium and fine spherical alumina fractions after independent classification and purification. The graded particle‑size design maximizes packing density. It serves as pre‑mixed thermally‑conductive filler for high‑thermal semiconductor EMC, simplifying compound formulation work while enhancing thermal dissipation and dimensional st

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Multi‑Modal Spherical Alumina Powder Blend CAS 1344‑28‑1, Ternary Particle Size for Maximum Packing & High‑Thermal EMC

This multi‑modal spherical alumina powder blend is manufactured from separately produced spherical α‑Al₂O₃ raw fractions. Each individual fraction undergoes plasma spheroidization, air classification, impurity removal and particle‑shape inspection before entering the batching process. Coarse‑size, medium‑size and fine‑size spherical alumina are gravimetrically dosed and homogenously blended under controlled low‑shear mixing conditions. Hard agglomerates and foreign grit are filtered out after blending.

Single‑size spherical alumina has inherent packing‑density limitations, with substantial interstitial voids existing between equal‑sized beads. The ternary multi‑modal formula adopts well‑defined particle‑size gradation: larger spherical beads form the primary skeleton structure; medium‑sized particles occupy partial inter‑bead gaps; fine‑size grains further fill the remaining micro‑voids. This grading strategy delivers maximum theoretical packing density for the inorganic filler system. Compared with single‑grade alumina, the pre‑mixed ternary blend allows higher total filler loading inside epoxy resin without causing an abrupt surge of melt viscosity. Dense alpha‑alumina crystal maintains stable thermal conductivity and excellent electrical insulation performance.

For high‑thermal EMC (epoxy molding compound) semiconductor packaging applications, this pre‑blended filler reduces the formulation complexity for EMC manufacturers. Formulators no longer need to purchase and mix three separate alumina grades on‑site. Higher inorganic loading raises the overall thermal conductivity of cured molding compound, facilitating heat dissipation from power chips and high‑performance integrated circuits. Meanwhile, the optimized melt viscosity preserves good flow behaviour during transfer‑molding processes. It lowers the coefficient of thermal expansion of cured EMC, mitigates residual thermal stress, and reduces risks of package delamination, micro‑cracking and popcorn failure during reflow soldering. This product is suitable for power semiconductor packaging, high‑power IC encapsulation and selected CPO modules.

Optional silane surface treatment can be performed on this ternary blend. Silane modification improves interfacial wetting between alumina particles and epoxy resin matrix, minimizes micro‑voids at phase boundaries, further boosts composite thermal conductivity and enhances the long‑term thermal‑cycling reliability of finished semiconductor packages.

During compounding and kneading operations, low‑to‑moderate shearing is required. Severe high‑shear kneading must be strictly avoided. Violent mechanical collision will fracture spherical beads, break the carefully designed ternary particle‑size distribution, sharply increase EMC melt viscosity and accelerate equipment abrasion. Once the graded particle‑size structure is destroyed, the maximum‑packing advantage will be lost.

Formulation adjustment is still required according to individual EMC resin systems. Although the blend is pre‑optimized, excessive total filler proportion will still deteriorate melt flow and lead to incomplete mold filling during transfer molding. When surface‑untreated grades are adopted, customers need to add suitable silane coupling agents in‑line within their compounding workflow.

The powder shall be packed in hermetically sealed moisture‑proof containers and stored inside a dry warehouse. Humidity‑induced particle agglomeration will degrade powder flow and EMC melt fluidity. Cross‑contamination with non‑graded single‑size alumina must be prevented during warehouse storage and feeding operations. Uncontrolled contamination disrupts the ternary particle‑size ratio and sacrifices maximum‑packing performance. This pre‑formulated multi‑modal ternary spherical α‑alumina blend is a dedicated high‑performance filler for high‑thermal EMC semiconductor packaging.

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.