CMP Grade Spherical Alumina Powder CAS 1344‑28‑1 is high‑purity nano spherical alpha‑alumina manufactured by controlled hydrothermal synthesis, plasma spheroidization and multi‑stage fractional classification. Strict removal of oversized rogue particles ensures narrow particle‑size distribution. Uniform nano‑spherical grains deliver mild and consistent cutting action. It serves as key solid abrasive for CMP polishing slurry, applied on semiconductor wafer, flat glass and precision optical compon

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CMP Grade Spherical Alumina Powder CAS 1344‑28‑1, Nano α‑Al₂O₃ for Wafer Glass Optical Precision Polishing

This CMP‑grade spherical alumina powder is produced from ultra‑high‑purity aluminum‑based precursor materials via hydrothermal crystallization, high‑temperature plasma spheroidization, multi‑stage centrifugal classification and rigorous fine screening. Critical purification workflows eliminate coarse rogue particles, hard agglomerates and heavy‑metal impurities. Finished product consists of discrete nano‑sized spherical α‑Al₂O₃ grains with tightly controlled narrow particle‑size distribution.

Compared with conventional irregular angular alumina abrasives, the rounded spherical particle profile softens the micro‑cutting effect during chemical‑mechanical polishing. It greatly reduces the probability of deep micro‑scratches, micro‑cracks and subsurface damage on delicate workpiece surfaces. The inherent high hardness of alpha‑alumina guarantees stable material‑removal rates during continuous polishing cycles. Heavy‑metal and ionic impurity levels are tightly controlled to avoid surface contamination on semiconductor wafers and optical substrates.

For semiconductor wafer CMP applications, this nano spherical alumina is dispersed into aqueous polishing slurry. Combined with customized pH regulators and chemical additives, the slurry performs material removal on silicon wafer, sapphire wafer and compound‑semiconductor substrates. Uniform nano‑abrasive grains support stable removal rates while minimizing surface defects, which is essential for advanced wafer manufacturing processes. Even trace coarse rogue particles must be eliminated, because a single oversized grain can produce fatal scratch damage on wafer surfaces.

For flat glass polishing, the abrasive is deployed in precision glass finishing for display‑grade glass substrates. It provides consistent surface planarization, reducing surface waviness and lowering surface roughness of thin glass panels.

For optical‑component precision polishing, the CMP‑grade alumina slurry is used for lenses, optical filters and optical‑ceramic parts. It delivers ultra‑smooth finished surfaces and helps to minimize light‑scattering defects on finished optical elements.

Surface dispersion treatment can be implemented upon request. The surface modification improves particle suspension stability within aqueous slurry, suppressing sedimentation and hard re‑agglomeration during slurry storage.

During slurry preparation, moderate‑speed dispersion and ultrasonic treatment are recommended to break soft secondary agglomerates. High‑energy bead‑milling with harsh grinding media must be avoided. Excessive mechanical grinding will fracture spherical nano‑grains and generate sharp‑edged fragments, which will introduce scratching defects in subsequent polishing operations.

Slurry solid loading needs thorough formulation trials. Excessive abrasive concentration will accelerate material‑removal speed but also raise the overall scratch risk. Insufficient abrasive dosage results in low removal efficiency and extended polishing cycle time.

The powder shall be stored in hermetically‑sealed, moisture‑proof containers inside a dry, dust‑free warehouse. Humidity will trigger irreversible hard agglomeration of nano‑particles, which ruins the polishing performance. Strict physical segregation from regular micron‑grade alumina powder is mandatory during storage and material handling. Even tiny contamination by coarse alumina particles will render this CMP‑grade material unsuitable for precision polishing production. This nano‑sized spherical α‑alumina is a high‑performance dedicated abrasive for semiconductor wafer, glass and optical‑component CMP precision polishing slurries.

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.