Electronic Grade Colloidal Silica Slurry CAS 7631-86-9 has controllable nano particle size and ultra-low metal ion impurities. It offers stable polishing rate and superior surface flatness, specially designed for semiconductor wafer CMP planarization process.

Product Detail

Colloidal Silica Slurry CAS 7631-86-9 for CMP Wafer Polishing Electronic Grade

Product Overview

Electronic Grade Colloidal Silica Slurry (CAS 7631-86-9) is a high-purity nano silica abrasive liquid specially formulated for semiconductor CMP planarization. Featuring ultra-low metal impurities, uniform particle size and excellent dispersion stability, this silica slurry delivers consistent polishing speed and ultra-smooth wafer surface. It effectively removes micro roughness and surface defects, achieving high-precision flatness for silicon wafers and semiconductor substrates.

Key Features

Electronic Grade Ultra-high Purity: Strictly controlled trace metal ions, no contamination, perfectly fit semiconductor manufacturing standards.
Uniform Nano Particle Size: No large particle agglomeration, effectively reduces wafer micro scratches and improves yield rate.
Stable CMP Polishing Performance: Steady removal rate, excellent planarization effect, low surface roughness.
Superior Dispersion Stability: Long-term storage without precipitation, delamination or gelation.
Easy Post-cleaning: Residue-free after cleaning, compatible with standard semiconductor cleaning processes.
Customizable Formula: Adjustable particle size, solid content and pH for different wafer polishing requirements.

Product Specifications

Product Name: Electronic Grade Colloidal Silica Slurry

CAS Number: 7631-86-9

Appearance: Transparent / Milky White Uniform Liquid

Raw Material: High-purity Nano Silicon Dioxide

Grade: Semiconductor Electronic Grade

Core Function: CMP Planarization, Surface Polishing, Defect Removal

Application: Silicon Wafer, Semiconductor Substrate, Optical Wafer Polishing

Application Scope

This electronic grade silica slurry is widely used in semiconductor CMP polishing, IC substrate planarization, monocrystalline silicon wafer polishing, sapphire wafer processing and MEMS component precision polishing. It is an ideal high-end abrasive material for semiconductor and optoelectronic manufacturing industries.

Usage Instructions

Stir the slurry uniformly before use. Dilute with high-purity deionized water according to process demands. Adopt low-speed stirring during polishing to maintain stable dispersion. Avoid high-speed agitation and long-term exposure to air. Keep sealed after use to prevent impurity contamination.

Packaging & Storage

Packaging: 25kg Clean Drum, Ultra-clean IBC Tank, Custom Packaging Available

Storage: Store in clean, cool and dry environment, avoid freezing and strong sunlight

Shelf Life: 6 months in original sealed packaging at normal temperature

Our Advantages

We provide strictly purified electronic grade CMP silica slurry with ultra-low heavy metal content and stable batch quality. Zero large particles ensures low scratch rate and high wafer yield. Custom polishing formulas and free sample testing are supported. Factory direct supply guarantees stable stock and fast global delivery with professional technical service.

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.