107 Silicone Base for Electronic Potting Compound is hydroxyl‑terminated polydimethylsiloxane, CAS 70131‑67‑8. This low‑impurity 107 silicone base is designed for condensation‑cure electronic potting compound. It features low ionic impurities and good filler compatibility. After curing, the silicone compound delivers outstanding dielectric property, moisture resistance and shock‑absorbing performance, widely used for encapsulation and protection of power modules, circuit boards and various elect

Product Detail

Product Overview

107 Silicone Base is hydroxyl‑terminated polydimethylsiloxane (107 silicone rubber), CAS 70131‑67‑8. It is core base polymer for condensation‑cure electronic potting compound. This grade adopts strict impurity control to reduce ionic substances which may cause corrosion to electronic devices. Precisely tuned hydroxyl value delivers stable cross‑linking reaction. Through standardized quality inspection, this raw material maintains stable viscosity and reactivity for large‑batch manufacturing of electronic protective silicone materials.

Key Features

Developed for condensation‑cure electronic potting compound formulation
Low ionic impurities to meet electronic‑grade requirements
Stable reactive hydroxyl terminal groups for controllable curing speed
Good compatibility with various insulating inorganic fillers
Cured silicone exhibits outstanding electrical insulation property
Excellent moisture resistance, dust‑proof and vibration damping performance
Moderate thermal stability for normal electronic service temperature
Low volatile content, consistent batch‑to‑batch performance

Main Applications

Two‑component condensation‑cure electronic potting compound
Encapsulation for circuit boards, power modules and power supplies
Moisture and shock protection for sensitive electronic assemblies
Insulating sealing compound for electrical components
Gap‑filling silicone for industrial electronic equipment
Custom condensation‑cure silicone for electronic protection application

Processing Suggestions

All feeding, mixing and dispersion operations must be finished under moisture‑free environment. Mix with insulating fillers, silane cross‑linking agent and matched catalyst. Adjust filler dosage to achieve target viscosity, hardness and dielectric index. Strictly avoid moisture ingress in the whole production procedure to prevent incomplete curing and surface tackiness.

Storage & Packing

Store in cool, dry and ventilated warehouse. Keep iron drum tightly sealed. Avoid moisture, high temperature and direct sunlight. Reseal drum immediately after partial material taking. Follow recommended storage conditions to retain polymer reactivity and guarantee shelf‑life.

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.