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Thermoplastic Copolyester Toughener, High-Molecular-Weight for Hot Melt Adhesive Solvent-Based Adhesive

Thermoplastic Copolyester Toughener is a high‑molecular‑weight polymeric modifier designed for adhesive systems. It improves impact resistance, peel strength and flexibility of cured adhesive layers without severely sacrificing thermal stability. This resin‑type toughening additive can be dissolved in suitable organic solvents or melted during hot‑melt processing. It is widely incorporated into hot‑melt adhesives and solvent‑based adhesive formulations for industrial bonding applications. JSY pr

Product Detail Page

Chemical IdentityProduct Name: Thermoplastic Copolyester Toughener Synonyms: Copolyester Impact Modifier, High‑MW Copolyester Resin Chemical Type: Amorphous‑semi‑crystalline thermoplastic copolyester resin Representative Structure: Condensation copolymer of aromatic and aliphatic di‑acids with diols No single CAS number, it is a polymeric copolymer mixture.

Typical Technical DataAppearance: Off‑white to light beige granular solid Color (APHA, molten): ≤180 Glass Transition Temperature Tg: ‑10 ~ 15 ℃ Melting Point Range: 95‑130 ℃ Intrinsic Viscosity: 0.75‑1.10 dl/g Acid Value: ≤2.5 mgKOH/g Moisture Content: ≤0.20% Softening Point: 100‑140 ℃

Key Features & Advantages

  • High‑molecular‑weight copolymer structure effectively improves toughness and peel resistance of adhesive films
  • Enhances low‑temperature impact performance, reducing cracking of cured adhesive joints under cold stress
  • Good thermal stability during hot‑melt processing, resisting thermal decomposition at normal melt‑processing temperatures
  • Can be dissolved in appropriate polar organic solvents for solvent‑based adhesive compounding
  • Excellent compatibility with many polyester, polyurethane and hot‑melt base resins

ApplicationsHot Melt Adhesive ModificationBlended into hot‑melt adhesive formulations to boost flexibility and improve resistance against brittle fracture after ageing, suitable for high‑stress bonding joints.

Solvent‑Based Adhesive ModificationDissolved in ketone or ester‑type solvents, used as a toughening modifier for solvent‑borne adhesive systems for plastic and composite substrate bonding.

Industrial Coating & Primer FormulationIncorporated into selected industrial primer coatings to enhance coating‑substrate impact resistance and adhesion performance.

Packaging, Storage & Shelf LifePacked in 25 kg moisture‑proof woven bags with inner PE liner. Store in cool, dry and well‑ventilated warehouse. Keep away from moisture, direct sunlight and heat sources. Prevent compression damage to bags. Under recommended storage conditions, shelf life is 12 months.

Compliance NoteThis industrial polymeric modifier is not intended for direct food‑contact usage. End‑formulators must conduct independent compliance verification for finished products.

Why Choose JSY

  • Stable batch‑to‑batch industrial‑grade quality of thermoplastic copolyester toughener
  • Capable of large‑volume bulk supply for recurring overseas adhesive‑manufacturer orders
  • Complete export‑supporting documents including MSDS, COA and packing list
  • Established supply experience for Southeast Asia, Middle East and Latin‑American industrial customers


Thermoplastic Copolyester Toughener, High-Molecular-Weight for Hot Melt Adhesive Solvent-Based Adhesive
Thermoplastic Copolyester Toughener is a high‑molecular‑weight polymeric modifier designed for adhesive systems. It improves impact resistance, peel strength and flexibility of cured adhesive layers without severely sacrificing thermal stability. This resin‑type toughening additive can be dissolved in suitable organic solvents or melted during hot‑melt processing. It is widely incorporated into hot‑melt adhesives and solvent‑based adhesive formulations for industrial bonding applications. JSY pr
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Thermoplastic Copolyester Toughener, High-Molecular-Weight for Hot Melt Adhesive Solvent-Based Adhesive

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  Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.


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