Spherical Fused Silica Powder General‑Purpose CAS 7631‑86‑9 is amorphous fused silica produced by high‑temperature melting and atomization of quartz raw material. The controlled particle‑size range is 5‑20μm. Featuring spherical particle morphology, low thermal expansion coefficient and moderate purity, this general‑grade filler reduces resin shrinkage, enhances dimensional stability, and improves mixing fluidity. It is suitable for epoxy molding compound (EMC) encapsulation and common resin fil

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Spherical Fused Silica Powder General‑Purpose CAS 7631‑86‑9, Amorphous SiO₂ 5–20μm for EMC Encapsulation & Resin Filler

This general‑purpose spherical fused silica powder is manufactured from high‑grade quartz feedstock through high‑temperature fusion, flame atomization and subsequent classification processing. The final product consists of amorphous non‑crystalline SiO₂ spherical particles, with tightly controlled particle‑size distribution between 5‑20μm. No significant sharp‑edged angular fragments remain after classification. Spherical particle geometry directly improves powder flowability and reduces melt viscosity when compounded with liquid epoxy resin.

Compared with angular ground silica, the spherical morphology decreases internal friction within resin‑filler slurry. It permits higher filler loading without excessive viscosity rise during compounding. The amorphous microstructure brings a low coefficient of thermal expansion, which helps to match the expansion behavior of semiconductor chips, copper lead frames and organic resin matrices. It effectively relieves internal thermal‑stress during curing and subsequent thermal cycling of electronic assemblies.

For EMC epoxy molding compound applications, this general‑grade fused silica serves as the primary mineral filler. It increases the hardness and modulus of cured molding compound, lowers overall shrinkage during post‑mold curing, and improves dimensional consistency for molded electronic packages. It helps suppress package warpage for medium‑size discrete semiconductor components and common integrated circuit devices.

In general resin filling scenarios including casting epoxy, insulating potting resin and structural epoxy composites, the powder improves compressive strength, reduces resin exothermic peak during cross‑linking curing, and enhances long‑term thermal‑ageing resistance of cured resin parts.

Typical impurity content is controlled for standard electronic requirements. This general‑purpose grade is not specified for ultra‑low‑alpha radiation applications, so it is not recommended for advanced high‑density memory chip encapsulation that demands strict alpha‑particle suppression.

During compounding processing, adequate high‑speed mixing is required to achieve homogeneous dispersion inside resin systems. Poor dispersion will introduce particle agglomerates, which may create voids, pinholes and surface defects on final molded or cast resin components. Filler loading should be optimized according to target viscosity, flow‑ability and mechanical specifications. Over‑high loading will sharply raise compound viscosity and impair mold filling performance during transfer molding.

The powder should be stored in sealed moisture‑proof packaging under dry indoor warehouse conditions. Avoid long‑term humid environment to prevent surface moisture absorption, which would negatively affect curing reaction of epoxy resin systems. Prevent cross‑contamination with finer or coarser silica grades during material handling and feeding operations. This general‑purpose spherical fused silica powder is a cost‑effective standard mineral filler for conventional EMC encapsulation and broad‑range resin filling applications within electronic manufacturing.

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Spherical Fused Silica Powder General-Purpose CAS 7631-86-9, Amorphous SiO₂ 5–20μm for EMC Encapsulation & Resin Filler

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.