Spherical Fused Silica Powder 3.2μm CAS 60676-86-0 CPU HBM Chip Encapsulation Filler
Spherical Fused Silica Powder 3.2μm is high‑purity amorphous spherical fused silica as direct replacement for Admatechs SO‑32R. The smooth spherical particle morphology improves the flowability of epoxy molding compound. It reduces coefficient of thermal expansion, relieves internal thermal stress and suppresses package warpage for high‑performance CPU and HBM memory chip encapsulation in advanced semiconductor packaging.
Product Overview Spherical Fused Silica Powder 3.2μm (CAS 60676‑86‑0, Admatechs SO‑32R Equivalent) is high‑purity amorphous fused silica powder with median particle size controlled at 3.2 μm. Uniform smooth spherical particles decrease melt viscosity of epoxy molding compound during chip encapsulation molding process. After homogeneous dispersion within epoxy resin matrix, this mineral filler effectively lowers overall thermal expansion coefficient, mitigates thermal‑induced internal stress and minimizes warpage risk for CPU and HBM high‑density memory packages. Strictly controlled low‑alpha‑ray impurity level prevents soft‑error issues for high‑end semiconductor devices. This spherical fused silica is dedicated filler for high‑reliability EMC materials for advanced CPU and HBM chip packaging.
Key Features ‑ Smooth spherical particle geometry improves fluidity of molten epoxy molding compound ‑ Low thermal expansion coefficient reduces warpage for high‑density chip packages ‑ Strictly controlled low alpha‑ray content to avoid soft‑error of memory chips ‑ Excellent thermal stability under high‑temperature epoxy curing conditions ‑ Direct functional equivalent grade for Admatechs SO‑32R spherical fused silica powder
Typical Technical Properties ‑ Chemical Type: High‑purity amorphous spherical fused silica ‑ Appearance: White free‑flowing fine powder ‑ Median Particle Size: 3.2 μm ‑ Bulk Density: Refer to TDS ‑ Alpha‑ray Count: Refer to TDS
Applications ‑ High‑end semiconductor EMC: Functional filler for CPU epoxy molding compound ‑ HBM memory chip packaging: Low‑stress mineral filler for high‑density memory encapsulation ‑ Electronic epoxy compounding: High‑purity spherical silica for advanced electronic encapsulant ‑ Electronic material plant: Raw filler for high‑reliability semiconductor packaging materials
Processing Recommendation Add spherical fused silica powder during the premixing stage for epoxy molding compound production. Optimize loading percentage to balance melt viscosity and thermo‑mechanical performance. Guarantee thorough homogeneous mixing. Perform encapsulation lab trials prior to mass EMC manufacturing.
Storage & Handling Store in cool, dry, dust‑free warehouse, avoid heavy‑metal contamination. Reseal packaging after opening. Wear dust‑proof mask and protective gloves while handling fine silica powder.
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