Spherical Alumina Filler α‑Al₂O₃ CAS 1344‑28‑1, D50 12μm for High‑Filling Thermal CPO & Heat Sink Substrate
Spherical α‑Al₂O₃ filler, CAS 1344‑28‑1, D50 12μm. It is produced by high‑temperature spheronization and multi‑stage air‑classification with stable alpha‑alumina crystal phase. This thermally conductive inorganic filler supports high loading within polymer matrix, forms continuous heat‑conducting pathways. It is used for high‑filling thermal resin, CPO semiconductor packaging and heat sink substrate composites to boost thermal dissipation and restrain thermal expansion of electronic thermal‑mana
Product Detail PageSpherical Alumina Filler α‑Al₂O₃ CAS 1344‑28‑1, D50 12μm for High‑Filling Thermal CPO & Heat Sink SubstrateThis spherical α‑alumina filler is manufactured via high‑temperature melting, spheronization treatment and multi‑stage air classification. It possesses stable alpha‑phase crystalline structure with high intrinsic thermal conductivity, excellent chemical resistance and outstanding thermal stability. The median particle size D50 is precisely controlled at 12 μm. Strict classification procedures eliminate oversized grit particles to reduce abrasive damage to compounding equipment during material processing.
Smooth spherical particle morphology effectively decreases inter‑particle friction in liquid resin or molten polymer. Compared with irregular crushed alumina powder, this spherical alumina grade allows substantially higher filler loading without causing excessive viscosity surge. Higher filling fraction facilitates the formation of interconnected thermal conduction networks inside the composite matrix, which greatly elevates the bulk thermal conductivity of finished thermal‑management parts.
When adopted for high‑filling thermal resin in CPO semiconductor packaging, the filler dissipates concentrated hot‑spot heat generated from high‑power packaged chips. It relieves thermal‑mechanical stress triggered by repeated temperature cycling, lowering potential risks of package delamination and internal micro‑cracks within the encapsulation layer. Trace alkali‑metal and ionic impurities are tightly controlled to suppress ion‑migration failure under high‑temperature and humid operating environments for advanced CPO modules.
For heat sink substrate composite applications, this spherical alumina serves as core inorganic filler inside thermally conductive composite substrates. It reduces overall thermal expansion coefficient of the substrate material, improves dimensional stability during lamination and high‑temperature assembly processes, and provides reliable heat‑spreading performance for high‑density electronic circuit boards.
The filler exhibits good baseline compatibility with epoxy and thermosetting resin systems. Custom silane surface modification can strengthen interfacial adhesion between alumina particle surfaces and polymer matrices, lowering interfacial thermal resistance and enhancing mechanical strength and moisture‑resistant performance of cured composites. It can be blended with finer spherical alumina powders to build graded particle‑size distribution, further maximizing achievable filler loading for customized high‑thermal recipes for CPO packaging and composite heat‑sink substrates.
The powder should be sealed and stored under dry low‑humidity conditions to avoid moisture absorption before batching and compounding. Cross‑contamination with angular crushed alumina must be avoided during weighing, pneumatic conveying and feeding operations. This D50 12 μm spherical α‑alumina filler functions as a high‑performance thermally conductive inorganic filler for high‑filling thermal resin, CPO semiconductor packaging and composite heat sink substrate materials.
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