Solvent Based Conductive Carbon Ink CAS 1333-86-4 is formulated with high-purity carbon black and solvent resin system. It features excellent permeability, filling ability and stable conductivity. After curing, the ink layer offers good adhesion and mechanical strength. It is specially developed for PCB through hole filling, circuit trace repairing and circuit board conductive connection.

Product Detail

Solvent Based Conductive Carbon Ink CAS 1333-86-4 Through Hole Filling PCB Repair Carbon Paste

Product Overview

Solvent Based Conductive Carbon Ink CAS 1333-86-4 is a solvent system conductive carbon paste made of high-purity carbon black and modified resin. It possesses outstanding fluidity, penetration and filling capacity, with stable conductive performance. After curing, the ink film features strong adhesion, proper hardness and excellent vibration resistance. This product is professionally designed for PCB through hole filling, broken circuit repairing and local conductive connection of printed circuit boards.

Core Features

Excellent Filling & Penetration: Good fluidity enables thorough filling of tiny through holes without voids.
Stable Conductivity: Uniform carbon black dispersion ensures consistent resistance for circuit conduction.
Strong Adhesion on PCB Surface: Firmly attach to FR-4 substrates, copper traces and solder mask.
Good Mechanical Strength: Cured layer resists friction, not easy to crack or fall off.
Simple Curing Process: Suitable for medium temperature curing, easy to operate in manual and semi-automatic repair work.
Fine Printability & Operability: Easy dispensing, brushing and screen printing for precision repair jobs.

Product Specifications

Product Name: Solvent Based Conductive Carbon Ink / PCB Repair Carbon Paste

CAS No: 1333-86-4

Appearance: Uniform black paste

System: Solvent-based resin system

Core Advantages: Good hole filling ability, stable conductivity, strong adhesion, easy curing

Applications: PCB through hole filling, circuit trace repair, conductive jumper connection

Applicable Substrates: FR-4 PCB, copper circuit, solder mask layer

Application Scope

This solvent conductive carbon paste is widely used in electronic maintenance and small-batch PCB production. Typical usage includes repairing broken PCB traces, filling small through holes to achieve vertical conduction, making conductive jumpers, prototype circuit modification and sampling board rework. It fits consumer electronics circuit boards, sensor PCBs and various prototype printed circuit boards.

Usage Guide

Stir the ink sufficiently before use to guarantee uniform conductivity. Clean the PCB repair area to remove dust, oil and oxide. Apply carbon paste by dispensing, brushing or screen printing according to hole size and line width. Complete heating curing following recommended temperature and time to obtain stable resistance and adhesion. Seal the container tightly after use to avoid solvent evaporation and paste drying.

Packaging & Storage

Packaging: 100g, 500g, 1kg packaging, customized packing available

Storage: Keep in cool, dry, ventilated place, away from flame, high temperature and direct sunlight

Shelf Life: 6 months under sealed normal temperature storage

Our Advantages

Our solvent-based PCB repair carbon ink has fine particle size and stable batch quality. It effectively solves poor hole filling, high resistance and easy peeling problems of ordinary repair carbon paste. With balanced conductivity and physical strength, it meets prototype testing and circuit maintenance requirements. Factory direct supply, fast delivery and free samples are available for customer verification.

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