Semiconductor Packaging Wax Microelectronic Component Moisture Protection Wax
Semiconductor Packaging Wax is a functional protective wax developed for semiconductor and microelectronic components. After melting and cooling down, it forms a thin, dense hydrophobic wax coating. The wax effectively blocks moisture and minor contaminants, safeguarding sensitive microelectronic devices against humidity‑induced damage in manufacturing, transit and intermediate storage procedures.
Product Overview Semiconductor Packaging Wax is dedicated protection wax formulated for semiconductor chips and microelectronic components. In molten condition, the wax exhibits suitable low‑viscosity fluidity. It can be applied by dipping or dispensing onto microelectronic parts. After cooling and solidification, a continuous thin hydrophobic protective film is generated on component surfaces. This barrier inhibits moisture absorption and prevents contamination by fine dust particles. It reduces the risk of oxidation and circuit malfunction of precision micro‑devices during interim storage and transportation before final encapsulation. Consistent thermal and chemical properties satisfy the requirements of semiconductor workshop processing.
Key Features ‑ Appropriate molten fluidity for uniform thin‑film coating on tiny microelectronic parts ‑ Dense hydrophobic solidified layer provides reliable moisture‑proof protection ‑ Low ash residue to avoid contamination on precision semiconductor surfaces ‑ Good adhesion to lead frames, silicon chips and packaging substrates ‑ Stable physical properties suitable for intermediate protection in semiconductor manufacturing
Typical Technical Properties ‑ Chemical Type: Blended refined hydrocarbon‑based semiconductor protective wax ‑ Appearance: Off‑white to pale cream solid pastilles or flakes ‑ Melting Range: Refer to TDS ‑ Ash Content: Refer to TDS ‑ Water Absorption: Refer to TDS
Applications ‑ Semiconductor intermediate protection: Temporary moisture‑proof coating for bare chips ‑ Microelectronic component storage: Protective wax layer for lead‑frame components ‑ Precision electronic workshop: Dipping‑type protection during component transit ‑ Electronic subcontract manufacturing: Auxiliary packaging material for micro‑parts handling
Processing Recommendation Melt the packaging wax under precise temperature control, strictly avoid over‑heating. Ensure semiconductor components are thoroughly dry prior to dipping or dispensing operations. After wax coating, complete cooling before stacking components. Run small‑scale process trials and contamination inspection before mass processing.
Storage & Handling Store in cool, dry, dust‑free warehouse away from heat sources. Reseal packaging immediately after opening. Wear protective gloves during handling solid wax.
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Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.
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