Products Center
High-Temperature IC Encapsulation Release Agent Fluorosilicone, 350℃ No Decomposition No Carbon Build-Up
High‑Temperature IC Encapsulation Release Agent Fluorosilicone is a high‑purity fluorosilicone‑based mold‑release material dedicated to harsh high‑temperature IC encapsulation conditions. The fluorine‑modified siloxane backbone delivers outstanding thermal stability. Under peak working temperature up to 350℃, it resists molecular decomposition and prevents stubborn carbon build‑up on precision mold cavities. During epoxy molding compound transfer‑molding cycles, it forms an ultra‑thin lubricatin
Water-Based Fiberglass Mold Release Agent Silicone-Fluoro Emulsion, Multi-Release Eco for FRP Compression Molding
Water‑Based Fiberglass Mold Release Agent Silicone‑Fluoro Emulsion is a waterborne non‑solvent functional release emulsion composed of modified silicone and fluorinated components stabilized by selected non‑ionic emulsifiers. When sprayed onto mold surfaces and fully dried, it develops a tough thin isolating film. The formulated film enables multi‑release performance for FRP compression molding processes including SMC and BMC. Without volatile organic solvents, this eco‑friendly product reduces
High-Temp Encapsulation Release Powder Montan Wax/PTFE Blend, 300℃+ Low Bleed for Electronic Packaging
High‑Temp Encapsulation Release Powder Montan Wax/PTFE Blend is a solid composite release additive combining refined montan wax and low‑molecular‑weight PTFE powder. Synergistic combination improves thermal stability compared with conventional single wax‑type release agents. During high‑pressure encapsulation molding above 300℃, it achieves moderate migration toward mold interface to form a thin lubricating isolating layer. It features low bleed property to minimize surface exudation. It is suit
Epoxy Molding Compound Internal Release Agent, No Impact on Packaging Reliability & Wire Bonding
Epoxy Molding Compound Internal Release Agent is a high‑purity functional processing additive developed for epoxy molding compound used in semiconductor IC encapsulation. It features well‑balanced compatibility with epoxy resin, curing agents and inorganic silica fillers. During high‑temperature transfer molding, the additive migrates moderately toward the mold‑metal interface to build an ultra‑thin lubricating isolation layer for clean demolding. Strict molecular design minimizes excessive surf
Mold Anti-Carbon Release Agent High-Temp Ester-Modified Silicone, Reduce Mold Cleaning for Rubber & Plastic
Mold Anti‑Carbon Release Agent High‑Temp Ester‑Modified Silicone is a high‑performance functional silicone release material with ester group modification on the siloxane molecular chain. The ester modification improves thermal stability and interfacial compatibility. At prolonged high‑temperature vulcanization and thermoplastic molding conditions, it inhibits the formation of stubborn carbonized deposits inside mold cavities. It builds a uniform lubricating isolating film during molding to reali
Wind Turbine Fiberglass Release Agent Semi-Permanent Fluorosilicone, Large-Size Compression Multi-Release No Residue
Wind Turbine Fiberglass Release Agent Semi‑Permanent Fluorosilicone is a high‑performance fluorosilicone‑based semi‑permanent mold‑release material, specially developed for oversized fiberglass composite parts of wind turbine equipment. After proper curing on mold surfaces, it creates a tough, continuous isolating film. This robust coating enables multi‑release cycles for large‑size FRP compression molding. It avoids heavy surface residues on fiberglass workpieces, facilitating subsequent sandin
Inorganic Nano Release Powder Silica/Boron Nitride Modified CAS 10043-11-5, Precision Rubber & Electronic Molding
Inorganic Nano Release Powder Silica/Boron Nitride Modified CAS 10043‑11‑5 is a high‑purity composite inorganic functional powder. It combines layered lubricating property of hexagonal boron nitride with high‑rigidity nano‑silica. Surface modification optimizes dispersion inside rubber and polymer matrix. During high‑temperature molding and vulcanization, it delivers solid lubrication and internal mold‑release effect. It avoids carbon‑forming decomposition risks common to organic wax‑based relea
High-Temperature IC Encapsulation Release Agent Fluorosilicone, 350℃ No Decomposition No Carbon Build-Up
High‑Temperature IC Encapsulation Release Agent Fluorosilicone is a high‑heat‑resistant fluorosilicone formulated for harsh high‑temperature IC encapsulation molding conditions. Its modified fluorinated‑siloxane molecular backbone delivers outstanding thermal stability. At peak working temperature up to 350℃, it resists thermal decomposition and avoids carbon build‑up on mold cavities. It forms a uniform ultra‑thin lubricating isolating layer during epoxy molding compound transfer molding. It fa
Water‑Based Fiberglass Mold Release Agent Silicone‑Fluoro Emulsion, Multi‑Release Eco for FRP Compression Molding
Water‑Based Fiberglass Mold Release Agent Silicone‑Fluoro Emulsion is a waterborne emulsion combining modified silicone and fluorinated functional components. It is an environmentally‑friendly mold‑release material free of harsh organic solvents. After spraying onto mold surfaces and water evaporation, it forms a durable thin isolating film. It supports multiple consecutive demolding cycles without repeated re‑coating. This multi‑release property is well‑suited for FRP compression molding produc
High-Temperature Fiberglass Release Agent Phenyl Silicone CAS 63148-58-3, 300℃ No Carbonization for GF-Reinforced Plastic
High‑Temperature Fiberglass Release Agent Phenyl Silicone CAS 63148‑58‑3 is a specialty phenyl‑modified silicone formulated for high‑temperature molding of glass‑fiber‑reinforced plastics. The introduction of phenyl groups onto silicone backbone significantly improves thermal stability compared with conventional methyl‑silicone products. During high‑temperature compression or injection molding, it forms a uniform thin isolating film on mold surfaces. It provides reliable demolding performance at
Epoxy Molding Compound Release Agent for Chip Encapsulation, High-Temp No Residue Packaging Reliability
Epoxy Molding Compound Release Agent is a specialty high‑temperature resistant release additive designed for epoxy molding compound used in semiconductor chip encapsulation. It is compatible with epoxy resin, curing agent and inorganic filler system of EMC. During high‑pressure transfer molding, it migrates moderately to the mold interface and forms an ultra‑thin lubricating isolation layer for smooth demolding of molded semiconductor packages. It is formulated to avoid stubborn surface residues
Wafer Release Agent Fluorosilicone, Semiconductor Wafer Dicing & Grinding Precision Electronic Processing
Wafer Release Agent Fluorosilicone is a high‑purity fluorinated silicone formulated for semiconductor precision manufacturing. With excellent thermal stability and low surface‑tension properties, this specialty release material forms an ultra‑thin temporary isolating film on wafer surfaces. It delivers reliable releasing performance during wafer dicing and wafer‑back grinding procedures. It minimizes residual contamination on wafer substrates, avoids interference to subsequent photolithography,
Jishengya Technology
Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.
点击右上角
分享给朋友吧
Copyright © 2005-2026 Shenzhen Jishengya Technology Co., Ltd. All Rights Reserved.
