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Silicone Rubber Release Water Dilutable Surfactant Lubricant, Spray-On Mold Surface for Easy Demolding

Silicone Rubber Release Water Dilutable Surfactant Lubricant, Spray-On Mold Surface for Easy Demolding

Silicone Rubber Release Water Dilutable Surfactant Lubricant is a water‑dilutable non‑silicone surfactant‑type releasing concentrate dedicated for silicone rubber mold surface treatment. It can be diluted with clean water before spraying onto pre‑heated mold cavities. As water evaporates, a thin durable lubricating isolating film is formed on the metallic mold surface. It facilitates clean demolding of complex silicone rubber molded articles during high‑temperature vulcanization. This water‑born
Silicone Rubber Internal Release Agent, Reduce Mold Cleaning Frequency for Silicone Compound Mixing

Silicone Rubber Internal Release Agent, Reduce Mold Cleaning Frequency for Silicone Compound Mixing

Silicone Rubber Internal Release Agent is a specialized functional additive designed for heat‑cured silicone rubber systems. It can be uniformly dispersed into silicone gum during compound mixing. Under high‑temperature vulcanization conditions, it moderately migrates towards the mold surface and forms an ultra‑thin lubricating isolating boundary layer. It facilitates smooth demolding of silicone rubber molded parts. It restricts the accumulation of cross‑linked silicone residues inside mold cav
General-Purpose Release Powder Zinc Stearate/Amide Wax Blend CAS 557-05-1, Cost-Effective Internal Additive for Rubber

General-Purpose Release Powder Zinc Stearate/Amide Wax Blend CAS 557-05-1, Cost-Effective Internal Additive for Rubber

General‑Purpose Release Powder Zinc Stearate/Amide Wax Blend CAS 557‑05‑1 is a cost‑effective composite processing additive formulated with zinc stearate and fatty amide wax. When homogenously mixed into rubber compounds, it provides internal lubrication throughout the vulcanization procedure. Under high‑temperature molding conditions, it migrates moderately to the mold interface to form a thin lubricating layer for smooth demolding. This blended powder decreases mold fouling frequency, shortens
TPU Release Powder Erucamide-Modified CAS 112-84-5, No Impact on TPU Transparency & Elasticity Injection Extrusion

TPU Release Powder Erucamide-Modified CAS 112-84-5, No Impact on TPU Transparency & Elasticity Injection Extrusion

TPU Release Powder Erucamide‑Modified CAS 112‑84‑5 is a surface‑modified erucamide processing powder designed for thermoplastic polyurethane. After homogeneous dispersion inside TPU resin matrix during compounding, it delivers moderate internal slip and mold‑releasing effect in injection‑molding and extrusion processes. The tailored modification treatment suppresses excessive surface blooming. It will not impair the inherent transparency, elongation and elastic recovery of finished TPU products.
SMC/BMC Fiberglass Release Agent Internal External, Surface Finish Improvement for Unsaturated Polyester Compression

SMC/BMC Fiberglass Release Agent Internal External, Surface Finish Improvement for Unsaturated Polyester Compression

SMC/BMC Fiberglass Release Agent Internal External is a multi‑functional composite releasing formulation developed for fiberglass‑reinforced unsaturated polyester SMC and BMC compression molding. It can be incorporated directly into the SMC / BMC compound as an internal additive, or applied onto mold surfaces as an external releasing coating. During high‑pressure hot compression cycles, it forms a uniform lubricating boundary layer between mold and composite stock. It reduces fiber‑printing, pit
Epoxy Molding Release Agent Solvent-Based Semi-Permanent Fluorosilicone, High-Gloss No Residue Post-Painting

Epoxy Molding Release Agent Solvent-Based Semi-Permanent Fluorosilicone, High-Gloss No Residue Post-Painting

Epoxy Molding Release Agent Solvent‑Based Semi‑Permanent Fluorosilicone is a solvent‑diluted reactive fluorosilicone formulation. After spraying onto cleaned mold surfaces and solvent evaporation, the fluorosilicone component undergoes thermal cross‑linking to form a dense, smooth low‑surface‑energy isolating film. This cured film supports multiple consecutive epoxy molding cycles without frequent re‑application. It helps molded epoxy components achieve excellent high‑gloss surface finish. Cruci
High-Purity PTFE Nano Release Powder CAS 9002-84-0, Metal-Ion-Free for Precision Rubber & Electronic Parts

High-Purity PTFE Nano Release Powder CAS 9002-84-0, Metal-Ion-Free for Precision Rubber & Electronic Parts

High‑Purity PTFE Nano Release Powder CAS 9002‑84‑0 is a fine nano‑grade polytetrafluoroethylene powder manufactured under strict purification control with extremely low metal‑ion content. Incorporated inside rubber or polymer matrix, it provides intrinsic lubricating performance. During high‑temperature vulcanization and molding, partial moderate migration forms a thin low‑friction boundary layer at the mold interface. It improves demolding behaviour for precision rubber and electronic molded pa
High-Temp Encapsulation Release Powder Montan Wax/PTFE Blend, 300℃+ Low Bleed for Electronic Packaging

High-Temp Encapsulation Release Powder Montan Wax/PTFE Blend, 300℃+ Low Bleed for Electronic Packaging

High‑Temp Encapsulation Release Powder Montan Wax/PTFE Blend is a high‑performance solid internal release additive compounded with refined montan wax and fine‑grade PTFE powder. Synergistic blending significantly improves the thermal stability compared with single montan‑wax‑based release agents. During high‑pressure encapsulation molding above 300℃, a controlled fraction migrates moderately to the mold interface and builds a thin lubricating isolating layer. Its low‑bleed property restrains sur
Epoxy Molding Compound Internal Release Agent, No Impact on Packaging Reliability & Wire Bonding

Epoxy Molding Compound Internal Release Agent, No Impact on Packaging Reliability & Wire Bonding

Epoxy Molding Compound Internal Release Agent is a high‑purity functional processing additive designed for epoxy molding compound in semiconductor IC encapsulation. It shows moderate compatibility with epoxy resin, curing agent and fused silica filler system. During high‑temperature transfer molding, only a controlled portion migrates towards the mold interface to build an ultra‑thin lubricating isolating layer for clean demolding. Optimized molecular structure effectively restrains excessive su
Mold Anti-Carbon Release Agent High-Temp Ester-Modified Silicone, Reduce Mold Cleaning for Rubber & Plastic

Mold Anti-Carbon Release Agent High-Temp Ester-Modified Silicone, Reduce Mold Cleaning for Rubber & Plastic

Mold Anti‑Carbon Release Agent High‑Temp Ester‑Modified Silicone is a high‑performance modified silicone releasing material with ester functional groups grafted onto siloxane molecular backbone. The ester modification optimizes high‑temperature thermal stability of silicone. During repeated hot vulcanization of rubber and high‑temperature thermoset‑plastic molding, it forms a continuous thin lubricating isolating film on mold cavity surfaces. It suppresses the formation of hard carbonized foulin
Wind Turbine Fiberglass Release Agent Semi-Permanent Fluorosilicone, Large-Size Compression Multi-Release No Residue

Wind Turbine Fiberglass Release Agent Semi-Permanent Fluorosilicone, Large-Size Compression Multi-Release No Residue

Wind Turbine Fiberglass Release Agent Semi‑Permanent Fluorosilicone is a high‑performance cross‑linkable fluorosilicone releasing material designed for oversized fiberglass composite components used in wind‑power equipment. After proper application and thermal curing on mold surfaces, it creates a durable, low‑surface‑energy isolating film. This cured film delivers stable multi‑release performance for large‑size FRP compression molding. It minimizes transfer residues onto fiberglass workpieces.
Inorganic Nano Release Powder Silica/Boron Nitride Modified CAS 10043-11-5, Precision Rubber & Electronic Molding

Inorganic Nano Release Powder Silica/Boron Nitride Modified CAS 10043-11-5, Precision Rubber & Electronic Molding

Inorganic Nano Release Powder Silica/Boron Nitride Modified CAS 10043‑11‑5 is a high‑purity composite inorganic functional filler. It combines the layered lubricating property of hexagonal boron nitride and the reinforcing effect of nano silica after special surface modification treatment. When mixed into rubber or polymer formulations, it disperses evenly within the matrix. During high‑temperature vulcanization and molding, part of the fine powder migrates moderately toward the mold interface a

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Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.


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