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(JSYAPG-TM50) Colloidal Silica Slurry Large-Particle 22nm 50% CAS 112926-00-8, High-Rate Rough Polish for Wafer & Glass
JSYAPG‑TM50 colloidal silica slurry is water‑based amorphous silica sol with average particle size of 22 nm and 50 wt% SiO₂ solid content. Adopting optimized electrostatic stabilization technology, this high‑concentration silica slurry avoids particle agglomeration at high solids. Larger‑size spherical nanoparticles provide strong abrasive capacity for rough polishing procedures on wafer and glass. The concentrated slurry can be used directly or diluted with deionized water to meet different rou
(JSYAPG-HS40) Colloidal Silica Slurry High-Solids 12nm 40% CAS 112926-00-8, CMP Oxide Planarization High Removal Rate
JSYAPG‑HS40 high‑solids colloidal silica slurry is water‑based amorphous silica sol with average particle size of 12 nm and 40 wt% solid content. Optimized electrostatic stabilization enables high silica loading without particle flocculation. This concentrated silica slurry delivers higher abrasive particle concentration to achieve high removal‑rate performance, mainly applied for oxide‑layer CMP planarization, and it can be diluted to target solid content for custom polishing formulations.
(JSYAPG-HS30) Colloidal Silica Slurry 12nm 30% SiO₂ CAS 112926-00-8, General-Purpose Silica Sol for Glass, Stone & CMP
JSYAPG‑HS30 colloidal silica slurry is water‑based amorphous silica sol featuring average particle size of 12 nm and 30 wt% SiO₂ solid content. The spherical silica nanoparticles adopt electrostatic stabilization system. It balances performance and cost for general‑industrial usage. This silica sol can be applied for glass polishing, stone surface consolidation, as well as conventional chemical‑mechanical polishing. It is available for direct use or further dilution in downstream formulation.
(JSYAPG-LS) Colloidal Silica Slurry Low-Sodium 12nm 30% CAS 112926-00-8, Low-Metal Nano Silica for Semiconductor Polishing
JSYAPG‑LS low‑sodium colloidal silica slurry is water‑based amorphous nano‑silica sol with an average particle size of 12 nm and 30 wt% solid content. It is manufactured under strict low‑metal‑ion controlled production conditions to minimize sodium and other residual metallic impurities. Spherical silica nanoparticles provide stable abrasive performance for semiconductor wafer polishing. This liquid silica slurry is suitable for electronic‑grade CMP processes and related high‑purity industrial a
(JSYAPG-SM) Colloidal Silica Slurry 7nm 30% SiO₂ CAS 112926-00-8, Sodium-Stabilized Nano Silica for Precision Polishing & Catalyst Carrier
JSYAPG‑SM colloidal silica slurry is water‑based amorphous nano silica sol with 7 nm average particle size and 30 wt% silica solid content. It adopts sodium‑ion electrostatic stabilization without extra organic dispersants. Spherical nano silica particles deliver mild abrasive property for ultra‑fine precision polishing, meanwhile the high specific‑surface‑area silica framework serves as an effective inorganic carrier for catalyst active components. This aqueous slurry can be used directly or di
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