This polymeric permanent antistatic agent is based on polyamide‑polyether block copolymer structure. Unlike conventional migratory surfactant‑type antistatic additives whose performance heavily relies on environmental humidity, this copolymer builds intrinsic conductive channels inside the polymer matrix. It features low‑bloom characteristic and avoids heavy surface exudation after thermal processing. It is suitable for modification of PP, PE, ABS and PS via extrusion compounding and injection m
Product DetailsPolyamide‑polyether block copolymer belongs to macromolecular polymeric antistatic modifier. Its molecular chain consists of hard polyamide segments and flexible hydrophilic polyether segments. During twin‑screw compounding, the copolymer is uniformly dispersed within PP, PE, ABS or PS resin matrix to form continuous micro‑conductive network domains throughout the bulk material instead of merely forming a thin hydrophilic film on the product surface.
Thanks to this internal conductive network, finished plastic parts obtain humidity‑independent antistatic capability. Static charges can dissipate through embedded conductive micro‑paths even in dry surroundings. It overcomes the typical disadvantage of small‑molecule antistatic additives: gradual loss of antistatic function caused by surface blooming, wiping or abrasion.
The low‑bloom property helps preserve original surface gloss, printing performance and painting adhesion of molded plastic components. It is applicable for injection‑molded electronic housing parts, extruded sheet and structural plastic components manufactured from PP, PE, ABS and PS. This antistatic copolymer is generally applied by preparing antistatic masterbatch first; the resulting masterbatch is then diluted with base resin during final molding.
Proper compounding temperature and screw speed must be controlled during twin‑screw extrusion to guarantee sufficient dispersion of the block‑copolymer within the host resin. Excessive shear or overheating may induce partial thermal degradation of polyether segments and weaken antistatic efficiency.
Recommended masterbatch loading in final molded articles ranges from 6 wt%‑15 wt%. Actual usage proportion depends on target volume resistivity requirements and base resin types. Pre‑production laboratory testing is mandatory to evaluate melt‑processing behaviour, dispersion state, volume and surface resistivity, surface gloss, mechanical properties and long‑term ageing resistance before mass production.
Store the pellet‑form product in sealed moisture‑proof bags inside cool, dry and ventilated warehouse. Prevent moisture absorption before extrusion processing. Avoid direct sunlight and sustained high‑temperature storage. Reseal packaging immediately after opening to reduce hygroscopic risk.

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