Nano Silica Dispersion Water-Based 10–100nm CAS 7631-86-9, Colloidal Silica for Coatings Adhesives & Precision Polishing
This water‑based nano silica dispersion is a stable colloidal silica suspension with particle size ranging from 10‑100 nm, CAS 7631‑86‑9. The spherical silica nanoparticles are uniformly dispersed inside aqueous medium without heavy agglomeration. When incorporated into coating and adhesive systems, it improves surface hardness, scratch resistance and mechanical strength of cured films. Meanwhile, the finely graded silica particles function as mild abrasive for precision polishing processes. Thi
Product DetailsThis colloidal silica dispersion consists of amorphous silicon dioxide nanoparticles suspended in deionized water. Surface modification treatment on nanoparticle surfaces prevents irreversible particle agglomeration and guarantees long‑term storage stability of the liquid slurry. Average particle size is controlled within 10‑100 nm and can be customized according to client technical specifications.
For coating applications: after being blended into water‑based coating formulations, the nano‑silica particles distribute evenly throughout the coating matrix. During curing, rigid silica nanoparticles form a micro‑reinforcing network within the dried coating film. The reinforced network significantly enhances surface hardness, anti‑scratch performance, wear resistance and thermal stability of the finished coating layer. It also improves anti‑blocking property for water‑borne top coats.
For adhesive applications: when added into aqueous adhesive systems, nano silica acts as reinforcing filler. It raises cohesive strength of the cured adhesive layer, improves heat‑resistance performance, and reduces shrinkage during curing without severely sacrificing initial tack property.
For precision polishing applications: the spherical, fine silica particles serve as chemical‑mechanical abrasive medium. Controlled particle hardness avoids deep scratching on workpiece surfaces. It is applicable for glass substrate polishing, optical component finishing and semiconductor‑related precision polishing processes.
Formulation compatibility testing is required before formal production. Extreme high‑pH or low‑pH raw materials, strong electrolytes and certain ionic additives may trigger destabilization, flocculation and sedimentation of the colloidal silica dispersion. Over‑dosage will sharply increase system viscosity of coatings or adhesives, deteriorate leveling property of wet film, and cause surface grain defects on cured layers. Insufficient loading cannot deliver expected reinforcement or polishing performance.
During processing operation, high‑speed violent shearing should be avoided. Excessive high shear force may break surface‑modified protective layers on silica nanoparticles and induce particle aggregation inside the final formulation.
Recommended dosage varies for different application fields: 2‑12 wt% for water‑based coatings; 3‑15 wt% for aqueous adhesives; 15‑40 wt% for precision polishing slurry preparation. Pre‑production laboratory evaluation must examine dispersion stability, system viscosity change, film hardness, scratch resistance, polishing abrasiveness and sedimentation tendency after long‑term ageing.
Store the water‑based nano silica dispersion inside sealed plastic containers in cool, dry and ventilated warehouse. Avoid direct sunlight and freezing condition. Freezing will destroy colloidal stability and cause irreversible particle agglomeration. Reseal containers tightly immediately after sampling. Periodic gentle agitation is suggested for long‑term stored batches before use.
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Nano Silica Dispersion Water-Based 10–100nm CAS 7631-86-9, Colloidal Silica for Coatings Adhesives & Precision Polishing
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