Micron Spherical Silica Filler 1.3–1.7μm CAS 7631-86-9, for Electronic Encapsulation Coating & CPO Filler
Micron spherical silica filler featuring particle‑size range of 1.3‑1.7μm, CAS 7631‑86‑9. Produced via high‑temperature fusion spheronization and multi‑stage air classification to form uniform amorphous spherical silica particles. It serves as key inorganic filler for electronic encapsulation coating and CPO semiconductor packaging, improving dimensional stability, reducing shrinkage and providing consistent electrical insulation within cured resin systems.
Product Detail PageMicron Spherical Silica Filler 1.3‑1.7μm CAS 7631‑86‑9, for Electronic Encapsulation Coating & CPO FillerThis micron spherical silica filler is manufactured by high‑temperature fusion and atomization followed by precise air‑classification, maintaining a tight particle‑size distribution from 1.3 μm to 1.7 μm. The production process yields smooth, non‑angular amorphous silica particles. Strict screening removes oversized grit particles that could scratch delicate semiconductor dies or fine circuit traces during coating and encapsulation processing.
Rounded particle morphology lowers inter‑particle friction when dispersed inside epoxy resin matrices. The filler improves slurry flow characteristics for electronic encapsulation coating, enabling uniform thin‑layer coating on semiconductor components without creating surface defects or particle‑induced pinholes. For CPO semiconductor packaging applications, incorporation of this silica filler reduces the coefficient of thermal expansion of cured resin composites. It relieves thermal‑mechanical stress generated during temperature cycling, lowering the occurrence of package delamination and micro‑cracks inside the encapsulation layer.
Trace ionic and metallic impurities are strictly controlled throughout raw‑material selection and purification processes. This guarantees long‑term electrical insulation performance for coated and encapsulated electronic parts under high‑humidity and elevated‑temperature service conditions. The base silica demonstrates good compatibility with epoxy, modified epoxy and thermoset coating resin systems. Optional silane surface modification can enhance interfacial adhesion between silica surface and polymer matrix, further boosting coating hardness, anti‑abrasion performance and moisture‑barrier properties of cured composite materials.
It can be blended with finer or coarser spherical silica grades for custom particle‑size grading to satisfy different coating thickness requirements, coating viscosity targets and CPO encapsulation formula specifications. The powder should be sealed and stored under low‑humidity conditions to prevent moisture absorption and particle agglomeration. Cross‑contamination with other mineral fillers must be prevented during weighing, conveying and batching procedures. This 1.3‑1.7 μm micron spherical silica filler is a premium inorganic filling material for electronic encapsulation coating and advanced CPO semiconductor packaging.
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