MX‑160 is a liquid core‑shell rubber (CSR) toughening masterbatch based on low‑viscosity epoxy carrier. Nano core‑shell rubber particles are uniformly pre‑dispersed within the low‑viscosity epoxy matrix, eliminating high‑shear mixing operations for formulators. This product delivers effective toughening performance without sharply raising overall system viscosity, which is critical for casting and potting processes requiring good flowability. It enhances crack resistance and thermal‑shock endura
Product Detail PageChemical IdentityMX‑160 is a ready‑to‑use liquid masterbatch with nano core‑shell rubber particles homogenously suspended in low‑viscosity liquid epoxy resin. The CSR rubber phase is synthesized via emulsion polymerization. Thanks to the low‑viscosity epoxy carrier, the finished masterbatch maintains comparatively low fluid viscosity, different from conventional high‑viscosity CSR epoxy masterbatches. Rubber particles are fully predispersed without hard agglomerates, so customers can directly blend MX‑160 into base epoxy resin. It shows good miscibility with various standard epoxy resins and is compatible with amine, anhydride and dicyandiamide curing agents. No grinding or pre‑dispersion pretreatment is required before formulation.
Key PerformanceAfter cross‑linking curing of the epoxy system, embedded nano CSR particles act as internal energy‑absorbing sites. When the cured epoxy suffers mechanical stress or rapid temperature fluctuation, these rubber domains dissipate fracture energy and stop crack propagation. The most outstanding advantage of MX‑160 lies in its limited viscosity increase after being blended into base epoxy. It avoids severe thickening issues that often occur when adding traditional CSR tougheners, preserving excellent flow and filling capacity for intricate narrow gaps during casting and potting. It significantly improves thermal‑shock resistance, reducing crack formation when potted electronic assemblies go through repeated cold‑hot cycling. In addition, the cured epoxy maintains favorable dielectric performance and basic heat‑resistance, which satisfies the requirements of electronic insulation components.
ApplicationsMX‑160 is primarily used for epoxy casting and electrical‑electronic potting and encapsulation. It is suitable for potting of transformers, sensors, power modules, high‑voltage electrical components and insulated coil casting parts. It works well for vacuum potting processes, where low mixed‑system viscosity is essential for void‑free filling inside complex component structures. This toughening masterbatch can be incorporated into one‑part and two‑part epoxy potting compounds for industrial electronics. It helps potting formulators to minimize internal cracking caused by thermal expansion mismatch between epoxy resin and embedded metal or ceramic inserts. It is also applicable for small‑size precision epoxy casting parts requiring high impact‑resistance.
Storage & HandlingStore MX‑160 in tightly sealed original drums inside cool and dry warehouse, recommended storage temperature 15‑25℃. Avoid long‑time storage under high‑temperature environment, which may cause gradual viscosity elevation. Low‑temperature storage will increase fluid viscosity; slow and gentle warming is allowed before processing. Prevent direct sunlight. Once the drum has been opened, reseal the container immediately to keep out moisture. Maintain sufficient ventilation in working areas during material transfer and formulation. Operators should wear safety goggles, chemical‑resistant gloves and protective clothing to avoid direct skin and eye contact with liquid resin.
Why Choose SupplierWe provide stable‑quality alternative grade for MX‑160 low‑viscosity CSR epoxy toughener for electronic casting and potting compound manufacturers. Complete TDS and MSDS documents are supplied for export‑oriented business. Bulk drum supply and small trial‑order packaging options are available. Our product supports overseas factories to formulate low‑viscosity, crack‑resistant epoxy potting and casting systems for power and electronic industry.

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