JSYAPG‑TMA amine‑stabilized colloidal silica slurry is water‑based amorphous nano‑silica sol with 34 wt% SiO₂ solid content. It uses organic amine as surface stabilizer instead of inorganic alkali ions. The silica slurry maintains stable colloidal state under alkaline working conditions. It is engineered for metal‑layer CMP and special‑pH polishing workflows, and can be further diluted or compounded into custom polishing slurries for electronic‑grade applications.

Product Detail

Product Detail Page: JSYAPG‑TMA amine‑stabilized colloidal silica slurry is composed of amorphous spherical silica nanoparticles homogeneously dispersed inside high‑purity deionized water. Organic amine molecules are adsorbed onto silica particle surfaces to build up surface charge, delivering strong electrostatic repulsion between individual nanoparticles. This unique stabilization system preserves colloidal stability within a targeted alkaline pH range and reduces the risk of gelation under high‑pH formulation environments. Strict impurity control is implemented throughout synthesis and purification to limit trace metallic contaminants.

For metal‑layer CMP applications in semiconductor fabrication, many metal polishing formulations require sustained alkaline working pH. Conventional sodium‑stabilized or ammonium‑stabilized silica sols may lose stability after blending with alkaline polishing additives. The amine‑stabilized silica base slurry exhibits excellent compatibility with alkaline chemical components. It supports consistent material removal on metal layers while minimizing scratch defects on the metal surface.

This silica sol serves as the key abrasive base material for special‑pH polishing formulations. Formulation engineers can adjust final pH value and working solid content by dilution with ultra‑pure deionized water and matched chemical additives according to specific process requirements.

Improper handling conditions should be avoided. Strong acid exposure, prolonged excessive heating and freezing will break the amine‑based colloidal equilibrium. Once irreversible gelation, flocculation or heavy sedimentation occurs, the slurry cannot be recovered for production use.

Major application fields include semiconductor metal‑layer CMP polishing, special alkaline‑pH precision polishing for optical components, functional ceramic planarization, and custom compounding of electronic‑grade polishing consumables.

Store the product in tightly sealed original plastic containers within 5‑35℃. Protect the containers from direct sunlight and freezing. Standard industrial packaging options include plastic drums and IBC totes for bulk liquid shipment. Gentle periodic circulation is recommended for long‑term warehousing to mitigate bottom sediment formation.

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(JSYAPG-TMA) Colloidal Silica Slurry Amine-Stabilized 34% CAS 112926-00-8, Alkaline CMP for Metal Layer & Special-pH Polish

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.