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Hollow Glass Microspheres for Adhesive Sealant, Low-Density Glass Bubbles for PU Epoxy Gap Filler

Hollow Glass Microspheres for Adhesive Sealant are premium hollow glass microbubble powder developed for polyurethane, epoxy adhesive and sealant gap-filling formulations. These ultra-fine microscopic hollow particles feature thin glass shell and sealed air cavity inside. When dispersed into PU or epoxy resin matrix, glass bubbles effectively reduce the overall density of sealant and gap-filling compounds. They cut curing shrinkage, minimize thermal stress and prevent void formation during curin

Chemical Identity / TDSProduct Name: Hollow Glass Microspheres for Adhesive Sealant Chemical Type: Low-Density Hollow Glass Microbubbles Physical Form: Free-flowing ultra-fine hollow microbead powder Core Benefit: Low-density glass bubbles for PU & epoxy gap filler, reduce density and shrinkage of adhesive sealant

Key PerformanceThese hollow glass bubbles reduce sealant density and control curing shrinkage. They improve paste sag resistance and maintain good mechanical strength of cured sealant. Multiple crush strength grades can be customized to match mixing pressure and curing process. Recommended loading ratio and mixing guidance refer to manufacturer TDS.

Applications

  • Epoxy potting compound gap filling modification
  • PU construction & industrial sealant formulation
  • Electronic component sealing and encapsulation
  • Composite panel seam gap filler
  • Assembly joint sealing material
  • Lightweight adhesive & sealant R&D

ComplianceInorganic hollow glass filler for adhesive and sealant. TDS, MSDS and relevant compliance certificates can be provided for export audit upon request.

Why Choose JSYShenzhen Jishengya Technology supplies factory direct Hollow Glass Microspheres for Adhesive Sealant. Our low-density glass bubbles deliver reliable density reduction and shrinkage control for PU and epoxy gap filler manufacturers.


Hollow Glass Microspheres for Adhesive Sealant, Low-Density Glass Bubbles for PU Epoxy Gap Filler
Hollow Glass Microspheres for Adhesive Sealant are premium hollow glass microbubble powder developed for polyurethane, epoxy adhesive and sealant gap-filling formulations. These ultra-fine microscopic hollow particles feature thin glass shell and sealed air cavity inside. When dispersed into PU or epoxy resin matrix, glass bubbles effectively reduce the overall density of sealant and gap-filling compounds. They cut curing shrinkage, minimize thermal stress and prevent void formation during curin
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Hollow Glass Microspheres for Adhesive Sealant, Low-Density Glass Bubbles for PU Epoxy Gap Filler

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  Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.


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