DMS is epoxy and polyether modified siloxane designed as silicone toughener for epoxy molding compound (EMC). It exists as transparent liquid silicone copolymer. The dual epoxy and polyether modification gives it good compatibility with epoxy resin matrix. It forms micro phase separated silicone domains inside cured epoxy network, lowering internal thermal stress. Meanwhile, it optimizes melt flowability during molding process. DMS is widely used in semiconductor chip encapsulation EMC formulati

Product Detail

Product Detail PageChemical IdentityDMS is organo-modified siloxane copolymer grafted with epoxy groups and polyether segments. The silicone backbone provides low modulus feature for stress buffering. Epoxy functional groups enable chemical bonding with epoxy resin and curing agent, preventing phase separation and migration. Polyether segments improve miscibility and flow property within EMC formula. It maintains stable chemical property under standard EMC compounding and molding temperature.

Key PerformanceDMS effectively reduces internal thermal stress of cured EMC, minimizing package cracking and warpage during thermal cycling. It improves melt flowability of epoxy molding compound for fine-pitch chip encapsulation. The silicone micro domains absorb thermal and mechanical stress without sacrificing electrical insulation performance. It shows good dispersion in EMC system and will not introduce obvious defects. It balances toughness, fluidity and reliability for semiconductor packaging.

ApplicationsDMS is primarily applied in epoxy molding compound for semiconductor chip encapsulation. Typical use covers IC packaging, transistor encapsulation, diode encapsulation and other microelectronic packaging. It fits EMC formulations requiring low stress, good mold filling and high long-term reliability.

Storage & HandlingStore DMS in sealed original containers inside cool, dry and ventilated warehouse. Recommended storage temperature 10-30℃. Avoid direct sunlight, heat source and high humidity. Prevent skin and eye contact during operation, wear proper protective equipment. Reseal tightly immediately after opening to avoid moisture contamination. Keep away from incompatible chemicals.

Why Choose SupplierWe supply stable DMS epoxy silicone toughener for EMC and semiconductor encapsulant manufacturers. Complete TDS and MSDS documents are available for export. Bulk shipment and small trial orders are supported. Our additive helps overseas factories produce low-stress EMC with excellent flowability for chip encapsulation.

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Epoxy Silicone Toughener DMS, Epoxy/Polyether Modified Siloxane for EMC Stress Relief Flowability Chip Encapsulation

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.