Electronic Grade Colloidal Silica Slurry CAS 7631-86-9 features controllable nano particle size and ultra-low metal ion impurities. It delivers stable polishing rate and superior surface flatness, specially developed for semiconductor wafer CMP planarization process.

Product Detail

Colloidal Silica Slurry CAS 7631-86-9 for CMP Wafer Polishing Electronic Grade

Product Overview

Electronic Grade Colloidal Silica Slurry CAS 7631-86-9 is a high-purity nano silica polishing solution independently developed for semiconductor CMP processes. With ultra-low metal impurity content, uniform and controllable nano particle size, and excellent dispersion stability, the product ensures consistent polishing efficiency and ultra-smooth wafer surface. It effectively removes surface microscopic defects, achieves high-precision planarization, and is the core high-purity abrasive material for semiconductor wafer polishing, chip processing and electronic component precision grinding.

Core Features

Ultra-high Purity & Low Impurity: Strictly controlled metal ion content, no heavy metal pollution, compliant with semiconductor electronic grade standards, avoiding wafer surface contamination and electrical performance damage.
Uniform Nano Particle Size: Precise particle size grading, uniform particle distribution, no large particle agglomeration, effectively reducing micro-scratches on wafer surface.
Stable Polishing Performance: Constant polishing rate and excellent planarization effect, ensuring high flatness and low roughness of polished wafer surface.
Excellent Dispersion & Stability: Long-term storage without precipitation, delamination and gelation, stable performance in high-precision continuous polishing production.
High Cleaning Performance: Easy to clean and remove after polishing, no residual particles on the substrate surface, simplifying the post-processing cleaning process.
Customizable Formulas: Adjustable solid content, particle size and pH value to meet different CMP polishing requirements of silicon wafers, sapphire wafers and semiconductor substrates.

Product Specifications

Product Name: Electronic Grade Colloidal Silica Slurry

CAS No: 7631-86-9

Appearance: Transparent or milky white homogeneous liquid

Effective Component: Nano Silicon Dioxide

Grade: Electronic Semiconductor Grade

Core Functions: Wafer planarization, surface polishing, micro defect removal

Applicable Process: Semiconductor CMP chemical mechanical polishing

Applicable Materials: Silicon wafer, sapphire wafer, ceramic substrate, electronic precision parts

Application Scope

This electronic grade colloidal silica slurry is specially used for high-precision polishing in the semiconductor and electronic industries. It is widely applicable for monocrystalline silicon wafer polishing, semiconductor chip substrate planarization, sapphire optical wafer polishing, MEMS device precision processing, and electronic ceramic component grinding. It is the ideal polishing material for high-end semiconductor manufacturing, optoelectronic device production and precision electronic processing, greatly improving the flatness, finish and yield of electronic substrates.

Usage Guide

Shake and stir the silica slurry evenly before use. According to the actual polishing process requirements, dilute it with high-purity deionized water in proportion. Adopt low-speed uniform stirring during the polishing process to maintain slurry dispersion stability. Avoid high-speed stirring and long-term air exposure to prevent particle aggregation and performance attenuation. After use, seal the container tightly to isolate dust and impurities.

Packaging & Storage

Packaging: 25kg clean plastic drum, ultra-clean IBC tank, support customized dust-free packaging

Storage: Store in dust-free, constant temperature and dry clean room environment, avoid freezing, high temperature and direct strong sunlight

Shelf Life: 6 months under sealed constant temperature dust-free storage

Our Advantages

Our electronic grade CMP colloidal silica slurry adopts ultra-purification treatment technology and strict dust-free production process, with ultra-low trace metal impurities, fully meeting semiconductor industry standards. The product has stable batch difference, controllable particle size and zero large particles, which can effectively reduce wafer scratch defects and improve product yield. We support personalized customization of solid content, particle size and formula parameters. Factory direct sales with sufficient inventory, fast delivery and professional electronic material technical support, providing one-stop polishing solution services for semiconductor and electronic processing manufacturers.

Previous : Anti-blocking Nano Silica Dispersion CAS 7631-86-9 for Plastic Film Surface Coating Next : CAS 7631-86-9 Nano Silica Sol High Solid Content for Inkjet Coating Gloss Enhancer

Copy product links

Long by picture save/share

Add Successfully

Continue To Visit Inquiry Now

Colloidal Silica Slurry CAS 7631-86-9 for CMP Wafer Polishing Electronic Grade

enquiry

Add Successfully

Continue To Visit Inquiry Now

Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.